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Co-authors
- E. Todd RyanIntel CorporationVerified email at intel.com
- Ishwara BhatProfessor, Electrical Computer Systems EngineeringVerified email at rpi.edu
- RUILONG XIEIBMVerified email at ibm.com
- Vimal KamineniGLOBALFOUNDRIES, College of Nanoscale Science and Engineering, Louisiana Tech UniversityVerified email at globalfoundries.com
- Kuan-Chih (Jacky) HuangRensselaer Polytechnic InstituteVerified email at intel.com
- Ajey JacobInformation Sciences Institute, University of Southern CaliforniaVerified email at isi.edu
- Kerem AkarvardarTSMCVerified email at tsmc.com
- Gwo-Ching WangRensselaer Polytechnic InstituteVerified email at rpi.edu
- Toh-Ming LuRensselaer Polytechnic InstituteVerified email at rpi.edu
- Thomas C ParkerUS Army Research LabVerified email at us.army.mil
- Kunaljeet TanwarVerified email at mckinsey.com
- Jinping LiuIntelVerified email at intel.com
- Bipul PaulGlobalfoundriesVerified email at globalfoundries.com
- Michael RizzoloIBMVerified email at us.ibm.com
- Prasad BhosaleSenior Process Technologist/Integration, Applied MaterialsVerified email at uw.edu
- Sunil Kumar SinghSamsung, HFC, GlobalFoundries, TSMC, Indian Institute of Technology Bombay, Indian Institute ofVerified email at samsung.com
- Jason Eugene StephensIntel, Apple, GlobalFoundries, IBM, University of Oregon, Southern Oregon UniversityVerified email at intel.com
- R. GaireApplied Materials, Albany, NYVerified email at amat.com
- Ravi Prakash SrivastavaSenior Member of Technical Staff, Master InventorVerified email at globalfoundries.com
- Lei SunGlobalfoundries, University of Rochester, Nankai UniversityVerified email at globalfoundries.com
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Nicholas LiCausi
PsiQuantum, GLOBALFOUNDRIES, Rensselaer Polytechnic Institute
Verified email at psiquantum.com