| Three-dimensional (3d) integrated heat spreader for multichip packages HK Dhavaleswarapu, RD Flynn, SK Saha US Patent App. 14/108,270, 2015 | 9 | 2015 |
| Thermal management of packages with 3D die stacking CP Chiu, JY Chang, S Saha 2012 7th International Microsystems, Packaging, Assembly and Circuits …, 2012 | 9 | 2012 |
| High performance transient uniform cooling solution for thermal compression bonding process Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ... US Patent 9,434,029, 2016 | 7 | 2016 |
| A unique computer-based spectrophotometric system with multiple height exposures of the cuvette to determine vertical velocity of spermatozoa for clinical and biological … D Paul, GC Majumder, S Saha, A Mukherjee, S Banerjee Indian Patent Application File, 2004 | 5 | 2004 |
| Challenges and opportunities in thermal management of multi-chip packages HK Dhavaleswarapu, CM Jha, SF Smith, S Kothari, B Bicen, SK Saha, ... International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 3 | 2015 |
| Reliability of base-isolated liquid storage tanks under horizontal base excitation SK Saha, VA Matsagar Numerical methods for reliability and safety assessment: Multiscale and …, 2015 | 3 | 2015 |
| Wind Response of Base-Isolated Building SK Saha, VA Matsagar, A Gupta 14th International Conference on Wind Engineering, Porto Alegre, Brazil, 2015 | 3 | 2015 |
| Smart Technologies in Data Science and Communication: Proceedings of SMART-DSC 2022 KA Ogudo, SK Saha, D Bhattacharyya Springer Nature, 2023 | 2 | 2023 |
| Contribution of structural wall damage in seismic loss of RC buildings S Saha, S Bong, RP Dhakal 12th international conference on structural safety and reliability, 6-10, 2017 | 2 | 2017 |
| Smart Technologies in Data Science and Communication SK Saha, PS Pang, D Bhattacharyya Springer Singapore, 2021 | 1 | 2021 |
| Analysis of Buildings in Hilly Terrain Under Multiple Hazards M Kulariya, SK Saha Proceeding of the 17th World Conference on Earthquake Engineering, Sendai …, 2020 | 1 | 2020 |
| Seismic Loss Estimation due to Damage of Structural Components for Buildings in Hilly Region Y Aggarwal, SK Saha 17th World Conference on Earthquake Engineering, 2020 | 1 | 2020 |
| High performance transient uniform cooling solution for thermal compression bonding process Z Li, HK Dhavaleswarapu, JB Petrini, S Devasenathipathy, SB Roach, ... US Patent 9,943,931, 2018 | 1 | 2018 |
| Improvement in Server Compute Performance Using Advanced Air Cooled Thermal Solutions D Kulkarni, S Ahuja, S Saha International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 1 | 2017 |
| Aerodynamic Design, Characterisation and Parameter Estimation of RLV-TD From Flight Data G Vidya, VR Ganesan, MM Patil, K Manokaran, AE Sivaramakrishnan, ... Journal of Aerospace Sciences and Technologies, 423-439, 2017 | 1 | 2017 |
| Challenges in solid booster separation dynamics analysis for a winged body R Yuvaraj, KKR Babu, R Saravanan, JA Tennyson, S Subramanian, ... Journal of Aerospace Sciences and Technologies, 502-514, 2017 | 1 | 2017 |
| ESTIMATION OF AEROTHERMAL ENVIRONMENT AT THE BASE REGION OF A LAUNCH VEHICLE JR Justus, P Anoop, SK Saha, B Sundar Proceedings of the 24th national and 2nd international ISHMT-ASTFE heat and …, 2017 | 1 | 2017 |
| Effects of isolation properties on expected seismic loss of base-isolated buildings SK Saha, RP Dhakal New Zealand Society for Earthquake Engineering (NZSEE) Annual Technical …, 2016 | 1 | 2016 |
| Investigation of Jet Effect on Aerodynamics of a launch vehicle using cluster of machines with GPU accelerators V Kumar, SK Saha, P Jeyajothiraj, V Ashok, TC Babu International Journal of Advances in Engineering Sciences and Applied …, 2014 | 1 | 2014 |
| Ubiquitous Computing and Multimedia Applications WI Grosky, T Kim, S Mohammed, SK Saha Springer-Verlag Berlin Heidelberg, 2010 | 1 | 2010 |
