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Dileep Kumar Mishra
Dileep Kumar Mishra
Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), IIT Bombay
Verified email at ime.a-star.edu.sg
Title
Cited by
Cited by
Year
Effects of tool electrode on EDM performance of Ti-6Al-4V
Rahul, DK Mishra, S Datta, M Masanta
Silicon 10, 2263-2277, 2018
772018
Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging
J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit
Journal of Materials Processing Technology 271, 542-553, 2019
692019
Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining
DK Mishra, AK Verma, J Arab, D Marla, P Dixit
Journal of Micromechanics and Microengineering 29 (7), 075004, 2019
442019
High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique
DK Mishra, J Arab, Y Magar, P Dixit
ECS Journal of Solid State Science and Technology 8 (6), P322, 2019
392019
Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining
SK Patro, DK Mishra, J Arab, P Dixit
Journal of Applied Electrochemistry 50, 169-184, 2020
292020
Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling
J Arab, DK Mishra, P Dixit
Measurement 168, 108463, 2021
252021
Micro array hole formation in glass using electrochemical discharge machining
J Arab, P Adhale, DK Mishra, P Dixit
Procedia Manufacturing 34, 349-354, 2019
252019
Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications
AK Verma, DK Mishra, K Pawar, P Dixit
Microsystem Technologies 26, 2105-2116, 2020
222020
Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications
VK Bajpai, DK Mishra, P Dixit
Applied Surface Science 584, 152494, 2022
202022
Effect of Tool Electrode-Workpiece Gap in the Microchannel Formation by Electrochemical Discharge Machining
DK Mishra, K Pawar, P Dixit
ECS Journal of Solid State Science and Technology 9 (3), 034011, 2020
182020
Experimental investigations into alumina ceramic micromachining by electrochemical discharge machining process
P Sharma, DK Mishra, P Dixit
Procedia Manufacturing 48, 244-250, 2020
172020
Through hole making by electro-discharge machining on Inconel 625 super alloy using hollow copper tool electrode
DK Mishra, ▪ Rahul, S Datta, M Masanta, SS Mahapatra
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of …, 2019
172019
Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process
DK Mishra, P Dixit
Journal of Manufacturing Processes 72, 93-104, 2021
132021
Multi-Response Optimization during Electro-Discharge Machining of Super Alloy Inconel 718: Application of PCA-TOPSIS
A Srivastava, DK Mishra, S Chatterjee, S Datta, BB Biswal, SS Mahapatra
132017
Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining
J Arab, DK Mishra, P Dixit
Procedia Manufacturing 48, 492-497, 2020
122020
Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process
T Singh, DK Mishra, P Dixit
Journal of Applied Electrochemistry 52 (4), 667-682, 2022
112022
Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications
DK Mishra, J Arab, K Pawar, P Dixit
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 263-266, 2019
102019
Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications
DK Mishra, T Singh, P Dixit
Materials and Manufacturing Processes 37 (12), 1463-1473, 2022
92022
Fabrication and Characterization of Through-glass vias (TGV) based 3D Spiral and Toroidal Inductors by Cost-effective ECDM Process
HK Kannojia, J Arab, A Sidhique, DK Mishra, R Kumar, J Pednekar, ...
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1192-1198, 2020
82020
Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining
DK Mishra, P Dixit
Materials and Manufacturing Processes 38 (8), 999-1008, 2023
42023
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Articles 1–20