| Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper HY Hsiao, CM Liu, H Lin, TC Liu, CL Lu, YS Huang, C Chen, KN Tu Science 336 (6084), 1007-1010, 2012 | 346 | 2012 |
| Electromigration and thermomigration in Pb-free flip-chip solder joints C Chen, HM Tong, KN Tu Annual Review of Materials Research 40, 531-555, 2010 | 299 | 2010 |
| Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes CY Liu, C Chih, CN Liao, KN Tu Applied Physics Letters 75 (1), 58, 1999 | 206 | 1999 |
| Electromigration in Sn-Pb solder strips as a function of alloy composition CY Liu, C Chen, KN Tu Journal of Applied Physics 88 (10), 5703-5709, 2000 | 203 | 2000 |
| Effect of current crowding on vacancy diffusion and void formation in electromigration KN Tu, CC Yeh, CY Liu, C Chen Applied Physics Letters 76 (8), 988-990, 2000 | 191 | 2000 |
| Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu CM Liu, HW Lin, YS Huang, YC Chu, C Chen, DR Lyu, KN Chen, KN Tu Scientific reports 5, 2015 | 188 | 2015 |
| Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy KN Tu, HY Hsiao, C Chen Microelectronics Reliability 53 (1), 2-6, 2013 | 174 | 2013 |
| Thermomigration in solder joints C Chen, HY Hsiao, YW Chang, F Ouyang, KN Tu Materials Science and Engineering: R: Reports 73 (9), 85-100, 2012 | 150 | 2012 |
| Electromigration issues in lead-free solder joints C Chen, SW Liang Journal of Materials Science: Materials in Electronics 18 (1-3), 259-268, 2007 | 134* | 2007 |
| Stress analysis of spontaneous Sn whisker growth KN Tu, C Chen, AT Wu Journal of Materials Science: Materials in Electronics 18 (1-3), 269-281, 2007 | 123* | 2007 |
| Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration SH Chiu, TL Shao, C Chen, DJ Yao, CY Hsu Applied physics letters 88 (2), 022110, 2006 | 120 | 2006 |
| Electromigration in eutectic SnPb solder lines QT Huynh, CY Liu, C Chen, KN Tu Journal of applied physics 89 (8), 4332-4335, 2001 | 120 | 2001 |
| Electromigration failure mechanisms for SnAg3. 5 solder bumps on Ti∕ Cr-Cu∕ Cu and Ni (P)∕ Au metallization pads TL Shao, YH Chen, SH Chiu, C Chen Journal of applied physics 96 (8), 4518-4524, 2004 | 118 | 2004 |
| Fabrication and characterization of (111)-oriented and nanotwinned Cu by Dc electrodeposition TC Liu, CM Liu, HY Hsiao, JL Lu, YS Huang, C Chen Crystal Growth & Design 12 (10), 5012-5016, 2012 | 114 | 2012 |
| Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces CM Liu, H Lin, YC Chu, C Chen, DR Lyu, KN Chen, KN Tu Scripta Materialia 78, 65-68, 2014 | 107 | 2014 |
| Tin whisker growth driven by electrical currents SH Liu, C Chen, PC Liu, T Chou Journal of applied physics 95 (12), 7742-7747, 2004 | 101 | 2004 |
| Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints CY Liu, C Chen, AK Mal, KN Tu Journal of Applied Physics 85 (7), 3882-3886, 1999 | 98 | 1999 |
| Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient JY Juang, CL Lu, KJ Chen, CCA Chen, PN Hsu, C Chen, KN Tu Scientific reports 8 (1), 13910, 2018 | 95 | 2018 |
| Eliminate Kirkendall voids in solder reactions on nanotwinned copper TC Liu, CM Liu, YS Huang, C Chen, KN Tu Scripta Materialia 68 (5), 241-244, 2013 | 93 | 2013 |
| Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes YW Chang, SW Liang, C Chen Applied physics letters 89 (3), 032103, 2006 | 91 | 2006 |
