Chih Chen
Chih Chen
National Yang Ming Chiao Tung University
Verified email at - Homepage
Cited by
Cited by
Electromigration and thermomigration in Pb-free flip-chip solder joints
C Chen, HM Tong, KN Tu
Annual Review of Materials Research 40, 531-555, 2010
Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper
HY Hsiao, CM Liu, H Lin, TC Liu, CL Lu, YS Huang, C Chen, KN Tu
Science 336 (6084), 1007-1010, 2012
Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
CY Liu, C Chih, CN Liao, KN Tu
Applied Physics Letters 75 (1), 58, 1999
Electromigration in Sn-Pb solder strips as a function of alloy composition
CY Liu, C Chen, KN Tu
Journal of Applied Physics 88 (10), 5703-5709, 2000
Effect of current crowding on vacancy diffusion and void formation in electromigration
KN Tu, CC Yeh, CY Liu, C Chen
Applied Physics Letters 76 (8), 988-990, 2000
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
KN Tu, HY Hsiao, C Chen
Microelectronics Reliability 53 (1), 2-6, 2013
Thermomigration in solder joints
C Chen, HY Hsiao, YW Chang, F Ouyang, KN Tu
Materials Science and Engineering: R: Reports 73 (9), 85-100, 2012
Electromigration issues in lead-free solder joints
C Chen, SW Liang
Journal of Materials Science: Materials in Electronics 18 (1-3), 259-268, 2007
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
CM Liu, HW Lin, YS Huang, YC Chu, C Chen, DR Lyu, KN Chen, KN Tu
Scientific reports 5, 2015
Stress analysis of spontaneous Sn whisker growth
KN Tu, C Chen, AT Wu
Journal of Materials Science: Materials in Electronics 18 (1-3), 269-281, 2007
Electromigration in eutectic SnPb solder lines
QT Huynh, CY Liu, C Chen, KN Tu
Journal of applied physics 89 (8), 4332-4335, 2001
Electromigration failure mechanisms for SnAg3. 5 solder bumps on Ti∕ Cr-Cu∕ Cu and Ni (P)∕ Au metallization pads
TL Shao, YH Chen, SH Chiu, C Chen
Journal of applied physics 96 (8), 4518-4524, 2004
Infrared microscopy of hot spots induced by Joule heating in flip-chip SnAg solder joints under accelerated electromigration
SH Chiu, TL Shao, C Chen, DJ Yao, CY Hsu
Applied physics letters 88 (2), 022110, 2006
Tin whisker growth driven by electrical currents
SH Liu, C Chen, PC Liu, T Chou
Journal of applied physics 95 (12), 7742-7747, 2004
Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
CY Liu, C Chen, AK Mal, KN Tu
Journal of Applied Physics 85 (7), 3882-3886, 1999
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
CM Liu, H Lin, YC Chu, C Chen, DR Lyu, KN Chen, KN Tu
Scripta Materialia 78, 65-68, 2014
Low-temperature growth of ZnO nanorods in anodic aluminum oxide on Si substrate by atomic layer deposition
CJ Yang, SM Wang, SW Liang, YH Chang, C Chen, JM Shieh
Applied physics letters 90 (3), 2007
Fabrication and characterization of (111)-oriented and nanotwinned Cu by Dc electrodeposition
TC Liu, CM Liu, HY Hsiao, JL Lu, YS Huang, C Chen
Crystal Growth & Design 12 (10), 5012-5016, 2012
Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes
YW Chang, SW Liang, C Chen
Applied physics letters 89 (3), 032103, 2006
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
TC Liu, CM Liu, YS Huang, C Chen, KN Tu
Scripta Materialia 68 (5), 241-244, 2013
The system can't perform the operation now. Try again later.
Articles 1–20