| Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology YA Shen, S Zhou, J Li, C Yang, S Huang, S Lin, H Nishikawa Materials & Design 183, 108144, 2019 | 65 | 2019 |
| Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy S Zhou, C Yang, S Lin, AN AlHazaa, O Mokhtari, X Liu, H Nishikawa Materials Science and Engineering: A 744, 560-569, 2019 | 49 | 2019 |
| Consideration of kinetics on intermetallics formation in solid-solution high entropy alloys TH Chou, JC Huang, CH Yang, SK Lin, TG Nieh Acta Materialia 195, 71-80, 2020 | 47 | 2020 |
| Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In Y Hirata, C Yang, S Lin, H Nishikawa Materials Science and Engineering: A 813, 141131, 2021 | 38 | 2021 |
| The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength S Zhou, C Yang, YA Shen, S Lin, H Nishikawa Materialia 6, 100300, 2019 | 33 | 2019 |
| CALPHAD-assisted morphology control of manganese sulfide inclusions in free-cutting steels S Lin, H Yang, Y Su, K Chang, C Yang, S Lin Journal of Alloys and Compounds 779, 844-855, 2019 | 23 | 2019 |
| A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders C Yang, S Zhou, S Lin, H Nishikawa Materials 12 (4), 631, 2019 | 17 | 2019 |
| Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging H Nishikawa, Y Hirata, C Yang, S Lin JOM 74 (4), 1751-1759, 2022 | 10 | 2022 |
| Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7 Cu/Cu Interface by Optimal Ga Additions TL Yang, Y Liu, C Yang, Y Kuo, S Lin JOM 72 (10), 3538-3546, 2020 | 6 | 2020 |
| Development of Sn-Bi-In-Ga quaternary low-temperature solders C Yang, S Zhou, S Lin, H Nishikawa 2019 International Conference on Electronics Packaging (ICEP), 367-369, 2019 | 4 | 2019 |
| High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1 C Yang, Y Liu, Y Hirata, H Nishikawa, S Lin Science and Technology of Welding and Joining 27 (7), 572-578, 2022 | 3 | 2022 |
| Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates TH Tseng, CH Yang, JY Chiang, JJ Huang, CH Chen, SK Lin, CM Wang, ... Materials Science and Engineering: A 759, 506-513, 2019 | 3 | 2019 |
| Phase equilibria, thermodynamic assessment, and the mechanical property of B2 phase of the Al-Ga-Ni ternary system C Yang, F Wu, S Lin Intermetallics 165, 108148, 2024 | 1 | 2024 |
| Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys C Yang, S Zhou, H Nishikawa, S Lin 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 1 | 2018 |
| On the Design of Sn-Bi-Ag-In and Sn-Bi-Ag-Zn Low-Temperature Pb-Free Solders Using High-Throughput CALPHAD Modeling and Key Experiments C Yang, Y Liu, Y Hirata, H Nishikawa, S Lin Available at SSRN 3967476, 0 | 1 | |
| Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders C Yang, Y Liu, H Nishikawa, S Lin Journal of Materials Research and Technology, 2024 | | 2024 |
| High thermal stability Cu-to-Cu joints fabricated by using Ga-based paste TH Huang, YC Liu, CE Cheng, CW Huang, CH Yang, CF Lin, CC Wang, ... 2022 International Conference on Electronics Packaging (ICEP), 127-128, 2022 | | 2022 |
| Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders CH Yang, YC Liu, Y Hirata, H Nishikawa, SK Lin 2022 International Conference on Electronics Packaging (ICEP), 37-38, 2022 | | 2022 |
| 計算相圖 (CALPHAD) 在材料製程上的應用 劉禹辰， 楊智涵， 顏紹宇， 林士剛 化工 67 (6), 155-166, 2020 | | 2020 |
| A novel TLP bonding based on sub-micron Ga particles S Lin, H Liao, C Yeh, C Yang 2019 International Conference on Electronics Packaging (ICEP), 240-241, 2019 | | 2019 |
Yu-An ShenFeng Chia UniversityVerified email at fcu.edu.tw
