| 3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing F Le, SWR Lee, Q Zhang Journal of Micromechanics and Microengineering 27 (4), 045012, 2017 | 15 | 2017 |
| Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering Q Zhang, JCC Lo, SWR Lee 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 15 | 2016 |
| Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation Q Zhang, JCC Lo, SWR Lee, W Xu, W Yang 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 15 | 2016 |
| Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays Q Zhang, C Yang, M Tao, F Song, SWR Lee 2013 IEEE 63rd Electronic Components and Technology Conference, 1788-1793, 2013 | 15 | 2013 |
| Development of innovative cold pin pull test method for solder pad crater evaluation Q Zhang, C Yang, M Tao, F Song, SWR Lee 2012 14th International Conference on Electronic Materials and Packaging …, 2012 | 11 | 2012 |
| Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components Q Zhang, JCC Lo, SW Ricky Lee, W Xu Journal of Electronic Packaging 140 (4), 041005, 2018 | 6 | 2018 |
| Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test Q Zhang, JCC Lo, SWR Lee 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 448-455, 2017 | 6 | 2017 |
| Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance Q Zhang, SW Ricky Lee Journal of Electronic Packaging 142 (2), 021008, 2020 | 4 | 2020 |
| Modeling of residual strain in BGA-PCB assemblies for pad cratering control Q Zhang, JCC Lo, SWR Lee 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 4 | 2017 |
| Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties Q Zhang, JCC Lo, SWR Lee, W Xu 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 718-723, 2018 | 3 | 2018 |
| Investigations on Electrolytic Capacitors to Improve Reliability under Assembly-Level Impact Conditions Q Zhang, N Sinenian, R Huang 2019 20th International Conference on Electronic Packaging Technology (ICEPT …, 2019 | 2 | 2019 |
| Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing Q Zhang, SWR Lee Journal of Electronic Packaging 144 (4), 041010, 2022 | 1 | 2022 |
| Strain Dominant Failure Criteria for Board Level Pad Cratering Under Over-stress and Fatigue Loading Q Zhang Hong Kong University of Science and Technology, 2017 | 1 | 2017 |
| Failures in Soldering Q Zhang, B Kondori, X Qiu, JCC Lo, SWR Lee | | 2021 |
| 焊点可靠性测试方法及其插针装置 Cold Pin Pull Test Method for Pad Cratering Evaluation Q Zhang, SWR Lee CN Patent CN 103293099 A, 2013 | | 2013 |
S W Ricky LeeChair Professor, HKUST, FIEEE, FASME, FInstP, FIMAPSVerified email at ust.hk
