| From Diagnosis to Treatment: Recent Advances in Patient-friendly Biosensors and Implantable Devices P Li†, GH Lee†, SY Kim†, SY Kwon, HR Kim, S Park ACS Nano, 2021 | 197 | 2021 |
| Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics GH Lee, YR Lee, H Kim, DA Kwon, H Kim, C Yang, SQ Choi, S Park, ... Nature Communications 13 (1), 2643, 2022 | 65 | 2022 |
| Hetero-Dimensional 2D Ti3C2TX MXene and 1D Graphene Nanoribbon Hybrids for Machine Learning-Assisted Pressure Sensors HJ Lee, JC Yang, J Choi, J Kim, GS Lee, SP Sasikala, GH Lee, SHK Park, ... ACS Nano, 2021 | 63 | 2021 |
| A Personalized Electronic Tattoo for Healthcare Realized by On‐the‐spot Assembly of an Intrinsically Conductive and Durable Liquid‐metal‐composite GH Lee, H Woo, C Yoon, C Yang, JY Bae, W Kim, DH Lee, H Kang, S Han, ... Advanced Materials 34, 2204159, 2022 | 58 | 2022 |
| Parallel Signal Processing of a Wireless Pressure‐Sensing Platform Combined with Machine‐learning‐based Cognition, Inspired by the Human Somatosensory System GH Lee, JK Park, J Byun, JC Yang, SY Kwon, C Kim, C Jang, JY Sim, ... Advanced Materials 32 (8), 1906269, 2020 | 54 | 2020 |
| Deep-learning-based Deconvolution of Mechanical Stimuli with Ti3C2TX MXene Electromagnetic Shield Architecture via Dual-mode Wireless Signal Variation Mechanism GH Lee, GS Lee, J Byun, JC Yang, C Jang, S Kim, H Kim, JK Park, HJ Lee, ... ACS Nano, 2020 | 25 | 2020 |
| Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics GH Lee, DH Lee, W Jeon, J Yoon, K Ahn, KS Nam, M Kim, JK Kim, ... Nature Communications 14 (1), 4173, 2023 | 9 | 2023 |
| Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics GH Lee, H Kim, J Lee, JY Bae, C Yang, H Kim, H Kang, SQ Choi, S Park, ... Materials Today 67, 84-94, 2023 | 8 | 2023 |
| A Personalized Electronic Tattoo for Healthcare Realized by On‐the‐Spot Assembly of an Intrinsically Conductive and Durable Liquid‐Metal Composite (Adv. Mater. 32/2022) GH Lee, H Woo, C Yoon, C Yang, JY Bae, W Kim, DH Lee, H Kang, S Han, ... Advanced Materials 34 (32), 2270236, 2022 | 4 | 2022 |
| Divide and Conquer: Design of Gallium‐Based Liquid Metal Particles for Soft and Stretchable Electronics G Park†, GH Lee†, W Lee†, J Kang, S Park, S Park Advanced Functional Materials, 2309660, 2023 | | 2023 |
| Liquid metal precursor solution, method for manufacturing metal film using the same, and electronic device including the same S Park, H Kim, G Lee, J Jeong US Patent App. 17/561,373, 2022 | | 2022 |
| Photo-Patternable, Large-Area Particle-Packed-Morphology Liquid Metal Film Coated via Solution Shearing for Soft Electronics GH Lee, JW Jeong, S Park MRS Fall Meeting 2021, 2021 | | 2021 |
| Photo-patternable, large-area solid-state liquid metal film coated via solution shearing for soft electronics GH Lee, H Kim, J Lee, C Yang, H Kang, S Park, J Kang, Z Bao, JW Jeong, ... | | 2021 |
| Wireless Communication: Parallel Signal Processing of a Wireless Pressure‐Sensing Platform Combined with Machine‐Learning‐Based Cognition, Inspired by the Human Somatosensory … GH Lee, JK Park, J Byun, JC Yang, SY Kwon, C Kim, C Jang, JY Sim, ... Advanced Materials 32 (8), 2070055, 2020 | | 2020 |
Jae-Woong JeongKorea Advanced Institute of Science and Technology (KAIST)Verified email at kaist.ac.kr
