Follow
Pradeep Dixit
Pradeep Dixit
IIT Bombay India, NTU Singapore, VTT Finland
Verified email at iitb.ac.in - Homepage
Title
Cited by
Cited by
Year
Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV)
X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman
2009 59th Electronic components and technology conference, 624-629, 2009
2062009
Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating
P Dixit, J Miao
Journal of the Electrochemical society 153 (6), G552, 2006
1742006
Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins
L Xu, P Dixit, J Miao, JHL Pang, X Zhang, KN Tu, R Preisser
Applied physics letters 90 (3), 033111, 2007
1002007
Effect of SF6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process
P Dixit, J Miao
Journal of Physics: Conference Series 34 (1), 095, 2006
612006
Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects
P Dixit, L Xu, J Miao, JHL Pang, R Preisser
Journal of Micromechanics and Microengineering 17 (9), 1749, 2007
602007
Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper
L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao
Journal of Applied Physics 104 (11), 113717, 2008
582008
Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking
P Dixit, J Miao, R Preisser
Electrochemical and solid-state letters 9 (10), G305, 2006
542006
Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating
P Dixit, CW Tan, L Xu, N Lin, J Miao, JHL Pang, P Backus, R Preisser
Journal of Micromechanics and Microengineering 17 (5), 1078, 2007
532007
High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE
P Dixit, J Miao
Journal of the Electrochemical Society 155 (2), H85, 2007
502007
Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging
J Arab, DK Mishra, HK Kannojia, P Adhale, P Dixit
Journal of Materials Processing Technology 271, 542-553, 2019
472019
Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating
P Dixit, X Chen, J Miao, S Divakaran, R Preisser
Applied surface science 253 (21), 8637-8646, 2007
472007
Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging
P Dixit, N Lin, J Miao, WK Wong, TK Choon
Sensors and Actuators A: Physical 141 (2), 685-694, 2008
462008
Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias
P Dixit, S Yaofeng, J Miao, JHL Pang, R Chatterjee, RR Tummala
Journal of the Electrochemical Society 155 (12), H981, 2008
452008
Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM
J Arab, HK Kannojia, P Dixit
Precision Engineering 60, 437-447, 2019
372019
Fabrication and characterization of through-glass vias by the ECDM process
HK Kannojia, J Arab, BJ Pegu, P Dixit
Journal of the Electrochemical Society 166 (13), D531, 2019
372019
Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining
DK Mishra, AK Verma, J Arab, D Marla, P Dixit
Journal of Micromechanics and Microengineering 29 (7), 075004, 2019
322019
Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate
P Dixit, J Miao
US Patent 7,850,836, 2010
302010
High aspect ratio glass micromachining by multi-pass electrochemical discharge based micromilling technique
DK Mishra, J Arab, Y Magar, P Dixit
ECS Journal of Solid State Science and Technology 8 (6), P322, 2019
292019
Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation
N Lin, J Miao, P Dixit
Microelectronics Reliability 53 (12), 1943-1953, 2013
282013
Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate
J Arab, P Dixit
Materials and Manufacturing Processes 35 (15), 1749-1760, 2020
252020
The system can't perform the operation now. Try again later.
Articles 1–20