| Photonic packaging: transforming silicon photonic integrated circuits into photonic devices L Carroll, JS Lee, C Scarcella, K Gradkowski, M Duperron, H Lu, Y Zhao, ... Applied Sciences 6 (12), 426, 2016 | 226 | 2016 |
| Reliability investigation of Cu/In TLP bonding JB Lee, HY Hwang, MW Rhee Journal of Electronic Materials 44, 435-441, 2015 | 51 | 2015 |
| Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and product made A Ramasamy, Y Jin, Y Liu, E Saugier, R Coffy, HY Hwang US Patent App. 13/594,498, 2014 | 50 | 2014 |
| High power SiC inverter module packaging solutions for junction temperature over 220° C DRM Woo, HH Yuan, JAJ Li, HS Ling, LJ Bum, Z Songbai, Z Hengyun, ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 31-35, 2014 | 39 | 2014 |
| Miniaturized double side cooling packaging for high power 3 phase SiC inverter module with junction temperature over 220° C DRM Woo, HH Yuan, JAJ Li, LJ Bum, Z Hengyun 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1190-1196, 2016 | 38 | 2016 |
| 77-GHz automotive radar sensor system with antenna integrated package KF Chang, R Li, C Jin, TG Lim, SW Ho, HY Hwang, B Zheng IEEE Transactions on components, packaging and manufacturing technology 4 (2 …, 2014 | 36 | 2014 |
| 77-GHz Automotive Radar Sensor System With Antenna Integrated Package” IEEE Transactions on Components KF Chang, R Li, C Jin, TG Lim, SW Ho, HY Hwang, B Zheng Packaging and Manufacturing Technology 4 (2), 352-359, 0 | 36* | |
| Flip chip packaging of digital silicon photonics MEMS switch for cloud computing and data centre HY Hwang, JS Lee, TJ Seok, A Forencich, HR Grant, D Knutson, N Quack, ... IEEE Photonics Journal 9 (3), 1-10, 2017 | 31 | 2017 |
| Through via package HY Hwang, KW Gan US Patent 8,922,013, 2014 | 28 | 2014 |
| Microfluidic packaging of high-density CMOS electrode array for lab-on-a-chip applications J Chung, HY Hwang, Y Chen, TY Lee Sensors and Actuators B: Chemical 254, 542-550, 2018 | 17 | 2018 |
| 128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre array HY Hwang, P Morrisey, JS Lee, J Henriksson, TJ Seok, MC Wu, P O'Brien Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th, 1-4, 2017 | 17 | 2017 |
| Characterization of pressure-less Ag sintering on Ni/Au surface LJ Bum, AJ Li, HH Yuan, PW Chih, YL Xin, RMW Daniel 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-4, 2015 | 6 | 2015 |
| Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions H Zhang, HY Hwang, L Bu, JJL Aw, DMW Rhee 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 618-623, 2014 | 6 | 2014 |
| Extreme high pressure and high temperature package development HH Yuan, EWL Ching, CY Sing, V Chidambaram, LJ Bum, EPJ Rong, ... 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 379-383, 2013 | 6 | 2013 |
| Co-optimizing grating couplers for hybrid integration of InP and SOI photonic platforms M Passoni, F Floris, HY Hwang, L Zagaglia, L Carroll, LC Andreani, ... AIP Advances 8, 095109, 2018 | 5 | 2018 |
| 12× 12 packaged digital silicon photonic MEMS switches TJ Seok, HY Hwang, JS Lee, A Forencich, HR Grant, D Knutson, N Quack, ... 2016 IEEE Photonics Conference (IPC), 629-630, 2016 | 5 | 2016 |
| Interfacial reaction and reliability of high temperature die attach solders for power electronics LJ Bum, HH Yuan, PW Chih, RMW Daniel 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-5, 2015 | 5 | 2015 |
| Study on power cycling reliability of power module with single metal layer flexible substrate by finite element analysis Z Chen, HY Hwang, N Jaafar, DMW Rhee 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-7, 2015 | 5 | 2015 |
| Chemical sensor package for highly pressured environment DRM Woo, HY Hwang, V Chidambaram, YS Chan, ELC Wai, JB Lee US Patent App. 14/583,261, 2015 | 5 | 2015 |
| Silicon photonic MEMS: Exploiting mechanics at the nanoscale to enhance photonic integrated circuits N Quack, H Sattari, AY Takabayashi, Y Zhang, P Edinger, ... 2019 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2019 | 4 | 2019 |
Padraic MorrisseyTechnology Manager, Photonic Packaging Group, Tyndall National Institute, Cork, IrelandVerified email at tyndall.ie
