| Au-Sn SLID bonding—properties and possibilities TA Tollefsen, A Larsson, OM Løvvik, K Aasmundtveit Metallurgical and materials transactions B 43, 397-405, 2012 | 112 | 2012 |
| Optimized Cu-Sn wafer-level bonding using intermetallic phase characterization TT Luu, ANI Duan, KE Aasmundtveit, N Hoivik Journal of Electronic Materials 42, 3582-3592, 2013 | 89 | 2013 |
| Intermetallic compound formation mechanisms for Cu-Sn solid–liquid interdiffusion bonding H Liu, K Wang, KE Aasmundtveit, N Hoivik Journal of electronic materials 41, 2453-2462, 2012 | 80 | 2012 |
| High temperature interconnect and die attach technology: Au–Sn SLID bonding TA Tollefsen, A Larsson, OM Løvvik, KE Aasmundtveit IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013 | 66 | 2013 |
| Wafer-level Cu/Sn to Cu/Sn SLID-bonded interconnects with increased strength H Liu, G Salomonsen, K Wang, KE Aasmundtveit, N Hoivik IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (9 …, 2011 | 66 | 2011 |
| Rheological characterization of a novel isotropic conductive adhesive–Epoxy filled with metal-coated polymer spheres HV Nguyen, E Andreassen, H Kristiansen, R Johannessen, N Hoivik, ... Materials & Design (1980-2015) 46, 784-793, 2013 | 54 | 2013 |
| Au-Sn SLID bonding: A reliable HT interconnect and die attach technology TA Tollefsen, A Larsson, MMV Taklo, A Neels, X Maeder, K Høydalsvik, ... Metallurgical and Materials Transactions B 44, 406-413, 2013 | 49 | 2013 |
| Fluxless wafer-level Cu-Sn bonding for micro-and nanosystems packaging N Hoivik, K Wang, K Aasmundtveit, G Salomonsen, A Lapadatu, ... 3rd Electronics System Integration Technology Conference ESTC, 1-5, 2010 | 44 | 2010 |
| Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction K Imenes, K Aasmundtveit, EM Husa, JO Høgetveit, S Halvorsen, OJ Elle, ... Biomedical Microdevices 9, 951-957, 2007 | 43 | 2007 |
| Wafer‐Level Solid–Liquid Interdiffusion Bonding N Hoivik, K Aasmundtveit Handbook of wafer bonding, 181-214, 2012 | 35 | 2012 |
| Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 C KE Aasmundtveit, TT Luu, HV Nguyen, R Johannessen, N Hoivik, K Wang 3rd Electronics System Integration Technology Conference ESTC, 1-6, 2010 | 33 | 2010 |
| Effect of temperature on the die shear strength of a Au-Sn SLID bond TA Tollefsen, OM Løvvik, K Aasmundtveit, A Larsson Metallurgical and Materials Transactions A 44, 2914-2916, 2013 | 32 | 2013 |
| Au–sn SLID bonding: Fluxless bonding with high temperature stability to above 350 °c KE Aasmundtveit, K Wang, N Hoivik, JM Graff, A Elfving 2009 European Microelectronics and Packaging Conference, 1-6, 2009 | 27 | 2009 |
| Carbon nanotube based gas sensor for expiration detection of perishable food HQ Nguyen, BQ Ta, N Hoivik, E Halvorsen, KE Aasmundtveit 2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013 …, 2013 | 24 | 2013 |
| Intermetallic Cu3Sn as oxidation barrier for fluxless Cu-Sn bonding H Liu, K Wang, K Aasmundtveit, N Hoivik 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 19 | 2010 |
| Cu/Sn SLID wafer-level bonding optimization TT Luu, A Duan, K Wang, K Aasmundtveit, N Hoivik 2013 IEEE 63rd Electronic Components and Technology Conference, 1531-1537, 2013 | 18 | 2013 |
| Characterization of wafer-level au-in-bonded samples at elevated temperatures TT Luu, N Hoivik, K Wang, KE Aasmundtveit, ASB Vardøy Metallurgical and Materials Transactions A 46, 2637-2645, 2015 | 17 | 2015 |
| Solid-Liquid Interdiffusion (SLID) bonding—Intermetallic bonding for high temperature applications KE Aasmundtveit, TA Tollefsen, TT Luu, A Duan, K Wang, N Hoivik 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-6, 2013 | 17 | 2013 |
| Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres HV Nguyen, E Andreassen, H Kristiansen, KE Aasmundtveit IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013 | 17 | 2013 |
| Direct integration of carbon nanotubes in Si microstructures KE Aasmundtveit, BQ Ta, L Lin, E Halvorsen, N Hoivik Journal of Micromechanics and Microengineering 22 (7), 074006, 2012 | 17 | 2012 |
