Qiu Zhao
Title
Cited by
Cited by
Year
Thermal stress induced delamination of through silicon vias in 3-D interconnects
KH Lu, SK Ryu, Q Zhao, X Zhang, J Im, R Huang, PS Ho
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
1342010
Micro-Raman spectroscopy and analysis of near-surface stresses in silicon around through-silicon vias for three-dimensional interconnects
SK Ryu, Q Zhao, M Hecker, HY Son, KY Byun, J Im, PS Ho, R Huang
Journal of Applied Physics 111 (6), 063513, 2012
1082012
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
T Jiang, SK Ryu, Q Zhao, J Im, R Huang, PS Ho
Microelectronics Reliability 53 (1), 53-62, 2013
1062013
Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis
KH Lu, SK Ryu, Q Zhao, K Hummler, J Im, R Huang, PS Ho
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1475-1480, 2011
212011
Extension of micro-Raman spectroscopy for full-component stress characterization of TSV structures
Q Zhao, J Im, R Huang, PS Ho
2013 IEEE 63rd Electronic Components and Technology Conference, 397-401, 2013
122013
Dielectric recoveries on O2 plasma damaged organosilicate low-k dielectrics
H Shi, JJ Bao, JJ Liu, H Huang, RS Smith, Q Zha, PS Ho, MD Goodner, ...
Proceedings of the Advanced Metallization Conference 23, 447, 2007
72007
Thermal stress characteristics and impact on device keep-out zone for 3-D ICs containing through-silicon-vias
T Jiang, SK Ryu, Q Zhao, J Im, HY Son, KY Byun, R Huang, PS Ho
2012 Symposium on VLSI Technology (VLSIT), 103-104, 2012
42012
Thermomechanical characterization and modeling for TSV structures
T Jiang, SK Ryu, Q Zhao, J Im, PS Ho, R Huang
AIP Conference Proceedings 1601 (1), 148-157, 2014
32014
Interfacial Delamination Between Through Silicon Vias (TSVs) and Silicon Matrix
KH Lu, SK Ryu, Q Zhao, R Huang, PS Ho
ASME International Mechanical Engineering Congress and Exposition 44281, 105-112, 2010
32010
Indentation of single-crystal silicon nanolines: Buckling and contact friction at nanoscales
B Li, Q Zhao, H Huang, Z Luo, MK Kang, JH Im, RA Allen, MW Cresswell, ...
Journal of Applied Physics 105 (7), 073510, 2009
32009
Mechanical Characterization of High Aspect Ratio Silicon Nanolines
B Li, H Huang, Q Zhao, Z Luo, JH Ln, SH Paul, KK Min, R Huang, ...
MRS Online Proceedings Library 1086 (1), 1-6, 2008
22008
Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales
H Huang, B Li, Q Zhao, Z Luo, J Im, MK Kang, RA Allen, MW Cresswell, ...
AIP Conference Proceedings 1143 (1), 204-212, 2009
12009
Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias
T Jiang, SK Ryu, Q Zhao, J Im, HY Son, KY Byun, R Huang, PS Ho
2012 IEEE 11th International Conference on Solid-State and Integrated …, 0
1
Thermo-mechanical stress measurement and analysis in three dimensional interconnect structures
Q Zhao
2014
Thermal-mechanical stress measurement and analysis in three dimensional interconnect structures with Raman spectroscopy
Q Zhao
2013
Mechanical Characterization of High Aspect Ratio Silicon Nanolines
H Huang, Q Zhao, Z Luo, JH Im, PS Ho, MK Kang, R Huang, ...
MRS Online Proceedings Library (OPL) 1086, 2008
2008
Nanoindentation of Si Nanostructures: Buckling and
H Huang, B Li, Q Zhao, Z Luo, J Im, MK Kang, RA Allen, MW Cresswell, ...
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