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Luhua Xu
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Cited by
Cited by
Year
Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo
Thin solid films 462, 370-375, 2004
2382004
Electromigration induced ductile-to-brittle transition in lead-free solder joints
F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang
Applied physics letters 89 (14), 141914, 2006
1402006
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
JHL Pang, L Xu, XQ Shi, W Zhou, SL Ngoh
Journal of Electronic Materials 33 (10), 1219-1226, 2004
1272004
The thermal stability and catalytic performance of Ce-Zr promoted Rh-Pd/γ-Al2O3 automotive catalysts
X Wu, L Xu, D Weng
Applied Surface Science 221 (1-4), 375-383, 2004
1272004
Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging
L Xu, JHL Pang
Thin solid films 504 (1-2), 362-366, 2006
1202006
Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
L Xu, JHL Pang, F Che
Journal of Electronic Materials 37 (6), 880-886, 2008
1182008
Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface
L Xu, JHL Pang, KH Prakash, TH Low
IEEE Transactions on Components and Packaging Technologies 28 (3), 408-414, 2005
1162005
Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins
L Xu, P Dixit, J Miao, JHL Pang, X Zhang, KN Tu, R Preisser
Applied physics letters 90 (3), 033111, 2007
982007
Structure and performance of γ-alumina washcoat deposited by plasma spraying
X Wu, D Weng, L Xu, H Li
Surface and Coatings Technology 145 (1-3), 226-232, 2001
762001
Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint
L Xu, JHL Pang
56th Electronic Components and Technology Conference 2006, 8 pp., 2006
682006
Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints
L Xu, JHL Pang, KN Tu
Applied physics letters 89 (22), 221909, 2006
622006
Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects
P Dixit, L Xu, J Miao, JHL Pang, R Preisser
Journal of Micromechanics and Microengineering 17 (9), 1749, 2007
592007
Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper
L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao
Journal of Applied Physics 104 (11), 113717, 2008
582008
Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
L Xu, JK Han, JJ Liang, KN Tu, YS Lai
Applied Physics Letters 92 (26), 262104, 2008
572008
Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish
WH Zhu, L Xu, JHL Pang, XR Zhang, E Poh, YF Sun, AYS Sun, CK Wang, ...
2008 58th Electronic Components and Technology Conference, 1667-1672, 2008
572008
Nanoindentation on SnAgCu lead-free solder joints and analysis
L Xu, JHL Pang
Journal of Electronic Materials 35 (12), 2107-2115, 2006
562006
Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating
P Dixit, CW Tan, L Xu, N Lin, J Miao, JHL Pang, P Backus, R Preisser
Journal of Micromechanics and Microengineering 17 (5), 1078, 2007
512007
Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability
L Xu, JHL Pang
56th Electronic Components and Technology Conference 2006, 6 pp., 2006
472006
Characteristics of surface-wave plasma with air-simulated N2–O2 gas mixture for low-temperature sterilization
L Xu, H Nonaka, HY Zhou, A Ogino, T Nagata, Y Koide, S Nanko, ...
Journal of Physics D: Applied Physics 40 (3), 803, 2007
452007
The NO selective reduction on the La1− xSrxMnO3 catalysts
X Wu, L Xu, D Weng
Catalysis Today 90 (3-4), 199-206, 2004
452004
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Articles 1–20