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Jerry Aw Jie Li
Jerry Aw Jie Li
Institute of Microelectronics
Verified email at ime.a-star.edu.sg
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Cited by
Year
High power SiC inverter module packaging solutions for junction temperature over 220°C
RPS Woo, Daniel Rhee Min Zhang Hengyun, Susai Lawrence Selvaraj, Sorono ...
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
35*2014
Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications
VS Rao, SC Chong, C Zhaohui, JL Aw, EWL Ching, H Gilho, ...
Electronics Packaging Technology Conference (EPTC 2013), 543-548, 2013
33*2013
Miniaturized double side cooling packaging for high power 3 phase SiC inverter module with junction temperature over 220° C
DRM Woo, HH Yuan, JAJ Li, LJ Bum, Z Hengyun
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1190-1196, 2016
252016
The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies
JS Karppinen, J Li, M Paulasto-Krockel
IEEE Transactions on Device and Materials Reliability 13 (1), 167-176, 2012
242012
Challenges of ultra-thin 5 sides molded WLCSP
T Tang, A Lan, J Wu, J Huang, J Tsai, J Li, A Ho, J Chang, WH Lin
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1167-1171, 2016
222016
Reliability assessment of a MEMS microphone under shock impact loading
J Li, J Makkonen, M Broas, J Hokka, TT Mattila, M Paulasto-Kröckel, ...
2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013
172013
Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling
HT Chen, T Mattila, J Li, XW Liu, MY Li, JK Kivilahti
2009 International Conference on Electronic Packaging Technology & High …, 2009
152009
Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/low-K chip
KY Au, FX Che, JL Aw, JK Lin, B Boehme, F Kuechenmeister
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 574-578, 2014
142014
Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking
L Xie, S Wickramanayaka, BY Jung, JAJ Li, L Jung-kai, D Ismael
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014
142014
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
JS Karppinen, J Li, TT Mattila, M Paulasto-Kröckel
Microelectronics Reliability 50 (12), 1994-2000, 2010
142010
Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad
KY Au, FX Che, JK Lin, HY Hsiao, X Zhang, S Lim, JL Aw, A Chow
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 936-942, 2016
132016
Microstructural evolution and mechanical properties of Au-20wt.% Sn| Ni interconnection
HQ Dong, V Vuorinen, XW Liu, T Laurila, J Li, M Paulasto-Kröckel
Journal of Electronic Materials 45 (1), 566-575, 2016
132016
Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics
FL Lau, RI Made, WN Putra, JZ Lim, VC Nachiappan, JL Aw, CL Gan
Microelectronics Reliability 53 (9-11), 1581-1586, 2013
112013
Methods for reliability assessment of MEMS devices—Case studies of a MEMS microphone and a 3-axis MEMS gyroscope
J Hokka, J Raami, H Hyvönen, M Broas, J Makkonen, J Li, TT Mattila, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 62-69, 2012
112012
Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading
T Laurila, J Karppinen, V Vuorinen, J Li, A Paul, M Paulasto-Kröckel
Journal of electronic materials 41 (11), 3179-3195, 2012
102012
Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies
LJ Bum, JAJ Li, DRM Woo
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 318-321, 2014
82014
Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking
L Xie, S Wickramanayaka, H Li, BY Jung, JL Aw, SC Chong
Electronics Packaging Technology Conference (EPTC 2013), 493-497, 2013
82013
Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process
SC Chong, JL Aw, EWL Ching, DI Cereno, HY Li, SR Vempati, KH Teo
Electronics Packaging Technology Conference (EPTC 2013), 250-254, 2013
7*2013
Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
T Laurila, J Karppinen, J Li, V Vuorinen, M Paulasto-Kröckel
Journal of Materials Science: Materials in Electronics 24 (2), 644-653, 2013
72013
3-D TSV Six-Die Stacking and Reliability Assessment of 20- m-Pitch Bumps on Large-Scale Dies
JB Lee, JL Aw, MW Rhee
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2016
62016
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