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Numerical investigation on the melting of nanoparticle-enhanced phase change materials (NEPCM) in a bottom-heated rectangular cavity using lattice Boltzmann method
Y Feng, H Li, L Li, L Bu, T Wang
International Journal of Heat and Mass Transfer 81, 415-425, 2015
Investigation on die shift issues in the 12-in wafer-level compression molding process
L Bu, S Ho, SD Velez, T Chai, X Zhang
IEEE Transactions on components, packaging and manufacturing technology 3 …, 2013
Comprehensive investigation of die shift in compression molding process for 12 inch fan-out wafer level packaging
Y Han, MZ Ding, B Lin, CS Choong
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1605-1610, 2016
Comprehensive study on the interactions of multiple die shift mechanisms during wafer level molding of multichip-embedded wafer level packages
HS Ling, B Lin, CS Choong, SD Velez, CT Chong, X Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014
Mechanism of Moldable Underfill (MUF) Process for RDL-1^ st Fan-Out Panel Level Packaging (FOPLP)
L Bu, FX Che, VS Rao, X Zhang
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1152-1158, 2019
Model test for water inrush caused by karst caves filled with confined water in tunnels
W Yang, X Yang, Z Fang, S Shi, H Wang, L Bu, L Li, Z Zhou
Arabian Journal of Geosciences 12 (24), 1-11, 2019
Numerical simulation of the water bubble rising in a liquid column using the combination of level set and moving mesh methods in the collocated grids
L Bu, J Zhao
International journal of thermal sciences 59, 1-8, 2012
Mechanism of Moldable Underfill (MUF) process for fan-out wafer level packaging
L Bu, FX Che, MZ Ding, SC Chong, XW Zhang
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-7, 2015
Numerical investigation to influence of perforation angle on hydraulic fracturing process
L Bu, S Li, S Shi, X Xie, L Li, Z Zhou
Geotechnical and Geological Engineering 37 (3), 1125-1133, 2019
High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging
KY Au, DM Zhi, V Chidambaram, B Lin, K Piotr, C KaiLiang
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 1-5, 2016
Numerical simulation of condensation of bubbles under microgravity conditions by moving mesh method in the double-staggered grid
L Pu, H Li, J Zhao, T Chen
Microgravity Science and Technology 21 (1), 15-22, 2009
Design and optimization of wafer-level compression molding process for one chip plus multiple decaps
L Bu, S Ho, SD Velez, LB Long, B Jung, T Chai, X Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (5 …, 2015
Simultaneous molding and under-filling for void free process to encapsulate fine pitch micro bump interconnections of chip-to-wafer (C2W) bonding in wafer level packaging
DV Sorono, SR Vempati, L Bu, SC Chong, CTW Liang, SW Wei
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 67-72, 2013
Numerical simulation of bubble dynamics in microgravity
L Pu, H Li, X Lv, J Zhao, T Chen, Y Zhu
Microgravity Science and Technology 20 (3), 247-251, 2008
MEMS WLCSP development using vertical interconnection
BY Jung, C Zhaohui, B Lin, DM Zhi, DZ Peng, CT Chong
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 455-458, 2016
Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions
H Zhang, HY Hwang, L Bu, JJL Aw, DMW Rhee
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 618-623, 2014
High-Performance TO Switches on Compact Cu-Dielectric-Si Hybrid Plasmonic WRRs
S Zhu, B Lin, GQ Lo, D Kwong
Study on momentum interpolation methods with curvilinear collocated grids in single-phase and two-phase flows
L Bu, J Zhao, KJ Tseng
Numerical Heat Transfer, Part B: Fundamentals 61 (4), 298-310, 2012
Development of high power and high junction temperature SiC based power packages
G Tang, LC Wai, TG Lim, YL Ye, PS Ravinder, L Bu, BL Lau, TC Chai, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1419-1425, 2019
Development of low profile Fan out PoP solution with embedded passive
BY Jung, DSW Ho, DV Sorono, SPS Lim, Z Chen, H Yong, B Lin, ...
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 597-600, 2014
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