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- David A MullerProfessor of Applied and Engineering Physics, Cornell UniversityVerified email at cornell.edu
- James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Daniel A. ChenetColumbia UniversityVerified email at columbia.edu
- Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Paul McEuenProfessor of Physics, Cornell UniversityVerified email at cornell.edu
- Jiwoong ParkUniversity of ChicagoVerified email at uchicago.edu
- Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
- Lei WangColumbia UniversityVerified email at columbia.edu
- Lola BrownCornell UniversityVerified email at cornell.edu
- Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- Robert HovdenUniversity of MichiganVerified email at cornell.edu
- Mark LevendorfAgility RoboticsVerified email at agilityrobotics.com
- Carlos S. Ruiz-VargasVoltaLabs.comVerified email at cornell.edu
- Joshua W. KevekLab Manager/Fault Isolation Engineer, IntelVerified email at cornell.edu
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Cheol-Joo KimDepartment of Chemical Engineering, Pohang University of Science and TechnologyVerified email at cornell.edu
- Inanc MericIntel Co.Verified email at intel.com
- Cory R. DeanColumbia UnviersityVerified email at phys.columbia.edu
- Kenneth ShepardLau Family Professor of Electrical Engineering and Professor of Biomedical Engineering, ColumbiaVerified email at ee.columbia.edu
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Pinshane Y. Huang
Associate Professor of Materials Science, University of Illinois
Verified email at illinois.edu - Homepage