| Study of optimal subset size in digital image correlation of speckle pattern images S Yaofeng, JHL Pang Optics and lasers in engineering 45 (9), 967-974, 2007 | 395 | 2007 |
| Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo Thin solid films 462, 370-375, 2004 | 265 | 2004 |
| A review of recent works on inclusions K Zhou, HJ Hoh, X Wang, LM Keer, JHL Pang, B Song, QJ Wang Mechanics of Materials 60, 144-158, 2013 | 255 | 2013 |
| Finite element formulation for a digital image correlation method Y Sun, JHL Pang, CK Wong, F Su Applied optics 44 (34), 7357-7363, 2005 | 254 | 2005 |
| Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study Y Bai, K Zhou, N Srikanth, JHL Pang, X He, R Wang RSC advances 6 (42), 35731-35739, 2016 | 253 | 2016 |
| Drop impact reliability testing for lead-free and lead-based soldered IC packages DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low Microelectronics reliability 46 (7), 1160-1171, 2006 | 218 | 2006 |
| Thermal cycling analysis of flip-chip solder joint reliability JHL Pang, DYR Chong, TH Low IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2001 | 210 | 2001 |
| Electromigration induced ductile-to-brittle transition in lead-free solder joints F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang Applied physics letters 89 (14), 2006 | 146 | 2006 |
| Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder JHL Pang, BS Xiong, TH Low 2004 proceedings. 54th electronic components and technology conference (IEEE …, 2004 | 146 | 2004 |
| Low cycle fatigue models for lead-free solders JHL Pang, BS Xiong, TH Low Thin solid films 462, 408-412, 2004 | 145 | 2004 |
| Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints JHL Pang, L Xu, XQ Shi, W Zhou, SL Ngoh Journal of Electronic Materials 33, 1219-1226, 2004 | 141 | 2004 |
| Vibration reliability test and finite element analysis for flip chip solder joints FX Che, JHL Pang Microelectronics reliability 49 (7), 754-760, 2009 | 135 | 2009 |
| Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability L Xu, JHL Pang, F Che Journal of Electronic Materials 37, 880-886, 2008 | 125 | 2008 |
| Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints FX Che, JHL Pang Journal of Alloys and Compounds 541, 6-13, 2012 | 123 | 2012 |
| Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging L Xu, JHL Pang Thin solid films 504 (1-2), 362-366, 2006 | 123 | 2006 |
| Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface L Xu, JHL Pang, KH Prakash, TH Low IEEE Transactions on Components and Packaging Technologies 28 (3), 408-414, 2005 | 122 | 2005 |
| Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models JHL Pang, DYR Chong IEEE Transactions on Advanced Packaging 24 (4), 499-506, 2001 | 119 | 2001 |
| Low cycle fatigue study of lead free 99.3 Sn–0.7 Cu solder alloy JHL Pang, BS Xiong, TH Low International Journal of Fatigue 26 (8), 865-872, 2004 | 116 | 2004 |
| Bulk solder and solder joint properties for lead free 95.5 Sn-3.8 Ag-0.7 Cu solder alloy JHL Pang, BS Xiong, CC Neo, XR Mang, TH Low 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 116 | 2003 |
| Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins L Xu, P Dixit, J Miao, JHL Pang, X Zhang, KN Tu, R Preisser Applied physics letters 90 (3), 2007 | 112 | 2007 |
