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John H L PANG
John H L PANG
Verified email at ntu.edu.sg
Title
Cited by
Cited by
Year
Study of optimal subset size in digital image correlation of speckle pattern images
S Yaofeng, JHL Pang
Optics and lasers in engineering 45 (9), 967-974, 2007
3442007
Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo
Thin solid films 462, 370-375, 2004
2402004
Finite element formulation for a digital image correlation method
Y Sun, JHL Pang, CK Wong, F Su
Applied optics 44 (34), 7357-7363, 2005
2282005
A review of recent works on inclusions
K Zhou, HJ Hoh, X Wang, LM Keer, JHL Pang, B Song, QJ Wang
Mechanics of Materials 60, 144-158, 2013
2152013
Drop impact reliability testing for lead-free and lead-based soldered IC packages
DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low
Microelectronics Reliability 46 (7), 1160-1171, 2006
2092006
Thermal cycling analysis of flip-chip solder joint reliability
JHL Pang, DYR Chong, TH Low
IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2001
2032001
Dependence of elastic and optical properties on surface terminated groups in two-dimensional MXene monolayers: a first-principles study
Y Bai, K Zhou, N Srikanth, JHL Pang, X He, R Wang
RSC advances 6 (42), 35731-35739, 2016
1562016
Electromigration induced ductile-to-brittle transition in lead-free solder joints
F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang
Applied physics letters 89 (14), 141914, 2006
1412006
Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder
JHL Pang, BS Xiong, TH Low
2004 proceedings. 54th electronic components and technology conference (IEEE …, 2004
1402004
Low cycle fatigue models for lead-free solders
JHL Pang, BS Xiong, TH Low
Thin solid films 462, 408-412, 2004
1322004
Vibration reliability test and finite element analysis for flip chip solder joints
FX Che, JHL Pang
Microelectronics reliability 49 (7), 754-760, 2009
1272009
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
JHL Pang, L Xu, XQ Shi, W Zhou, SL Ngoh
Journal of Electronic Materials 33 (10), 1219-1226, 2004
1272004
Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging
L Xu, JHL Pang
Thin solid films 504 (1-2), 362-366, 2006
1202006
Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
L Xu, JHL Pang, F Che
Journal of Electronic Materials 37 (6), 880-886, 2008
1192008
Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface
L Xu, JHL Pang, KH Prakash, TH Low
IEEE Transactions on Components and Packaging Technologies 28 (3), 408-414, 2005
1162005
Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models
JHL Pang, DYR Chong
IEEE Transactions on Advanced Packaging 24 (4), 499-506, 2001
1152001
Bulk solder and solder joint properties for lead free 95.5 Sn-3.8 Ag-0.7 Cu solder alloy
JHL Pang, BS Xiong, CC Neo, XR Mang, TH Low
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
1112003
Low cycle fatigue study of lead free 99.3 Sn–0.7 Cu solder alloy
JHL Pang, BS Xiong, TH Low
International Journal of Fatigue 26 (8), 865-872, 2004
1082004
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints
FX Che, JHL Pang
Journal of Alloys and Compounds 541, 6-13, 2012
1052012
Mechanical properties for 95.5 Sn–3.8 Ag–0.7 Cu lead-free solder alloy
JHL Pang, BS Xiong
IEEE Transactions on components and packaging technologies 28 (4), 830-840, 2005
1002005
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Articles 1–20