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Jae-Bum Pyo
Jae-Bum Pyo
Assistant Professor of Mechanical & Automotive Engineering, Kongju National University
Verified email at kongju.ac.kr
Title
Cited by
Cited by
Year
Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations
JB Pyo, TI Lee, C Kim, MS Kim, TS Kim
Soft matter 12 (18), 4135-4141, 2016
162016
Highly mobile levitating soft actuator driven by multistimuli‐responses
JH Kim, JB Pyo, TS Kim
Advanced Materials Interfaces 7 (21), 2001051, 2020
142020
Design of magnetic force field for trajectory control of levitated diamagnetic graphite
S Kang, J Kim, JB Pyo, JH Cho, TS Kim
International Journal of Precision Engineering and Manufacturing-Green …, 2018
132018
Layer-by-layer assembly of free-standing nanofilms by controlled rolling
S Kang, JB Pyo, TS Kim
Langmuir 34 (20), 5831-5836, 2018
122018
Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates
TI Lee, C Kim, JB Pyo, MS Kim, TS Kim
Composite Structures 176, 973-981, 2017
102017
Tubular hygromechanical polymeric brake for soft and compact wearable robots
KS Lee, JB Pyo, TS Kim, HS Park
ACS Applied Polymer Materials 3 (6), 3206-3213, 2021
42021
Highly robust nanostructured carbon films by thermal reconfiguration of ionomer binding
JB Pyo, JH Kim, TS Kim
Journal of Materials Chemistry A 8 (46), 24763-24773, 2020
32020
Intrinsic swelling behavior of free-standing nanoporous ionomer-bound carbon films
JB Pyo, S Lee, TS Kim
Polymer Testing 100, 107241, 2021
22021
Electrical resistance change in thermally reconfigured nanoporous ionomer-bound carbon films
JB Pyo, JH Kim, K Kim, TS Kim
Journal of Materials Chemistry A 9 (22), 13019-13025, 2021
22021
Improvement of mechanical durability of brittle electrode for hydrogen fuel cell
JB Pyo
Impact 2022 (1), 45-47, 2022
2022
Effect of anisotropic mechanical properties of woven composite substrates on warpage orientation of printed circuit boards
TI Lee, C Kim, JB Pyo, MS Kim, TS Kim
2017 International Conference on Electronics Packaging (ICEP), 566-567, 2017
2017
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Articles 1–11