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Hongyu Li
Hongyu Li
Institute of microelectronics
Verified email at ime.a-star.edu.sg
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Cited by
Year
Development of through silicon via (TSV) interposer technology for large die (21× 21mm) fine-pitch Cu/low-k FCBGA package
X Zhang, TC Chai, JH Lau, CS Selvanayagam, K Biswas, S Liu, D Pinjala, ...
2009 59th Electronic components and technology conference, 305-312, 2009
1252009
Built-in via module test structure for backend interconnection in-line process monitor
HY Li, WH Li, LY Wong, N Hwang
Proceedings of the 12th International Symposium on the Physical and Failure …, 2005
862005
A 2.45-GHz near-field RFID system with passive on-chip antenna tags
X Chen, WG Yeoh, YB Choi, H Li, R Singh
IEEE Transactions on Microwave Theory and Techniques 56 (6), 1397-1404, 2008
712008
Enzymatic cleaning of ultrafiltration membranes fouled by protein mixture solutions
HB Petrus, H Li, V Chen, N Norazman
Journal of Membrane Science 325 (2), 783-792, 2008
542008
Achieving stable through-silicon via (TSV) capacitance with oxide fixed charge
L Zhang, HY Li, S Gao, CS Tan
IEEE Electron Device Letters 32 (5), 668-670, 2011
502011
Simulation of protein ultrafiltration using CFD: Comparison of concentration polarisation and fouling effects with filtration and protein adsorption experiments
P Schausberger, N Norazman, H Li, V Chen, A Friedl
Journal of membrane science 337 (1-2), 1-8, 2009
482009
Development of Large Die Fine-Pitch Cu/Low-FCBGA Package With Through Silicon via (TSV) Interposer
TC Chai, X Zhang, JH Lau, CS Selvanayagam, P Damaruganath, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (5 …, 2011
452011
Development of wafer-level warpage and stress modeling methodology and its application in process optimization for TSV wafers
F Che, HY Li, X Zhang, S Gao, KH Teo
IEEE transactions on components, packaging and manufacturing technology 2 (6 …, 2012
422012
Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds
CS Tan, L Peng, J Fan, H Li, S Gao
IEEE Transactions on Device and Materials Reliability 12 (2), 194-200, 2012
412012
Cleaning strategies for membrane fouled with protein mixtures
V Chen, H Li, D Li, S Tan, HB Petrus
Desalination 200 (1-3), 198-200, 2006
412006
High-density 3-D interconnect of Cu–Cu contacts with enhanced contact resistance by self-assembled monolayer (SAM) passivation
L Peng, H Li, DF Lim, S Gao, CS Tan
IEEE Transactions on Electron Devices 58 (8), 2500-2506, 2011
402011
Removal of mid spatial-frequency features in mirror segments
G Yu, H Li, D Walker
Journal of the European Optical Society-Rapid Publications 6, 2011
342011
Evaluation of chemical cleaning of UF membranes fouled with whey protein isolates via analysis of residual protein components on membranes surface
N Norazman, W Wu, H Li, V Wasinger, H Zhang, V Chen
Separation and Purification Technology 103, 241-250, 2013
332013
Ultrafine Pitch (6) of Recessed and Bonded Cu–Cu Interconnects by Three-Dimensional Wafer Stacking
L Peng, L Zhang, J Fan, HY Li, DF Lim, CS Tan
IEEE electron device letters 33 (12), 1747-1749, 2012
332012
Wafer level warpage modeling methodology and characterization of TSV wafers
FX Che, HY Li, X Zhang, S Gao, KH Teo
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1196-1203, 2011
332011
On-chip antenna and a method of fabricating the same
LH Guo, HY Li, M Tang
US Patent 8,201,746, 2012
322012
A small OCA on a 1/spl times/0.5-mm/sup 2/2.45-GHz RFID Tag-design and integration based on a CMOS-compatible manufacturing technology
LH Guo, AP Popov, HY Li, YH Wang, V Bliznetsov, GQ Lo, ...
IEEE electron device letters 27 (2), 96-98, 2006
322006
Fast electroplating TSV process development for the via-last approach
HY Li, E Liao, XF Pang, H Yu, XX Yu, JY Sun
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
262010
On the impact of through-silicon-via-induced stress on 65-nm CMOS devices
R Weerasekera, HY Li, LW Yi, H Sanming, J Shi, J Minkyu, KH Teo
IEEE Electron Device Letters 34 (1), 18-20, 2012
252012
3D interconnection process development and integration with low stress TSV
TT Chua, SW Ho, HY Li, CH Khong, EB Liao, SP Chew, WS Lee, LS Lim, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
242010
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