| Effects of Sn grain structure on the electromigration of Sn–Ag solder joints Y Wang, KH Lu, V Gupta, L Stiborek, D Shirley, SH Chae, J Im, PS Ho Journal of Materials Research 27 (8), 1131-1141, 2012 | 68 | 2012 |
| Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints DR Shirley, HR Ghorbani, JK Spelt Microelectronics Reliability 48 (3), 455-470, 2008 | 35 | 2008 |
| Lidded integrated circuit package DR Shirley US Patent 9,190,341, 2015 | 30 | 2015 |
| Effects of wiring density and pillar structure on chip package interaction for advanced Cu low-k chips W Chu, L Spinella, DR Shirley, PS Ho 2020 IEEE International Reliability Physics Symposium (IRPS), 1-4, 2020 | 18 | 2020 |
| Effect of Sn grain structure on electromigration reliability of Pb-free solders Y Wang, KH Lu, V Gupta, L Stiborek, D Shirley, J Im, PS Ho 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 711-716, 2011 | 14 | 2011 |
| Primary creep in sn-3.8 Ag-0.7 Cu solder, part II: Constitutive creep model development and finite element analysis DR Shirley, JK Spelt Journal of electronic materials 38, 2388-2397, 2009 | 5 | 2009 |
| Flip chip assembly with advanced RDL technology S Wen, KR Park, P Thompson, D Shirley, JS Lee, HJ Park 2013 14th International Conference on Electronic Packaging Technology, 57-59, 2013 | 3 | 2013 |
| Primary creep in Sn3. 8Ag0. 7Cu solder. Part I: theory, experiments, and data reduction DR Shirley, JK Spelt Journal of electronic materials 38 (11), 2376-2387, 2009 | 2 | 2009 |
| Transient and Steady-state Creep in a SnAgCu Lead-free Solder Alloy: Experiments and Modeling DR Shirley University of Toronto, 2009 | 2 | 2009 |
| Evaluation of the effect of solder paste residues on RF signals between 5 and 10 GHz DR Shirley | 2 | 2004 |
| Lid for integrated circuit package DR Shirley US Patent 9,793,190, 2017 | 1 | 2017 |
| Electro-optic package featuring sputtered EMI shield R Coccioli, PC Ravva, DR Shirley, J Li, S Ramdas, H Kobeissi, S Yong US Patent 11,694,971, 2023 | | 2023 |
| 2.5 D Silicon Photonics Interposer Flip Chip Attach P Tumne, HC Wang, DR Shirley, R Coccioli 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1896-1902, 2023 | | 2023 |
| Semiconductor device package with semiconductive thermal pedestal H Gao, E Ali, S Ramdas, DR Shirley, R Coccioli US Patent App. 17/444,964, 2023 | | 2023 |
| Semiconductor package inhibiting viscous material spread CK Chee, DR Shirley, H Gao US Patent App. 17/239,327, 2022 | | 2022 |
Yiwei WangUniversity of Texas at AustinVerified email at utexas.edu
Yiwei WangUniversity of Texas at AustinVerified email at utexas.edu