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Co-authors
- Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoVerified email at ee.t.u-tokyo.ac.jp
- Tomoyuki YokotaUniversity of TokyoVerified email at ntech.t.u-tokyo.ac.jp
- Naoji MatsuhisaAssociate Professor, Research Center for Advanced Science and Technology, The University of TokyoVerified email at iis.u-tokyo.ac.jp
- Kenjiro FukudaThin-Film Device Laboratory, RIKENVerified email at riken.go.jp
- Peter ZalarApple Inc.Verified email at apple.com
- Martin KaltenbrunnerSoft Matter Physics and LIT Soft Materials Lab, Johannes Kepler University LinzVerified email at jku.at
- Sungjun ParkElectrical and Computer Engineering, Ajou UniversityVerified email at ajou.ac.kr
- Wonryung LeeKorea Institute of Science and Technology (KIST)Verified email at kist.re.kr
- Itaru OsakaHiroshima UniversityVerified email at hiroshima-u.ac.jp
- Xiaomin XuAssociate Professor, Shenzhen International Graduate School (SIGS), Tsinghua UniversityVerified email at sz.tsinghua.edu.cn
- Kazuo TakimiyaTohoku UniversityVerified email at tohoku.ac.jp
- Tsuyoshi Sekitani, Ph.D, ProfessorThe Institute of Scientific and Industrial Research,Osaka UniversityVerified email at sanken.osaka-u.ac.jp
- Keisuke TajimaRIKEN Center for Emergent Matter Science (CEMS)Verified email at riken.go.jp
- Yasutoshi JimboSony Semiconductor SolutionsVerified email at ntech.t.u-tokyo.ac.jp