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tai chong chai
tai chong chai
institute of Microelectronics, Singapore
Verified email at ime.a-star.edu.sg
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Cited by
Year
Development of 3-D silicon module with TSV for system in packaging
N Khan, VS Rao, S Lim, HS We, V Lee, X Zhang, EB Liao, R Nagarajan, ...
IEEE Transactions on Components and Packaging Technologies 33 (1), 3-9, 2010
1832010
Development of high density fan out wafer level package (HD FOWLP) with multi-layer fine pitch RDL for mobile applications
VS Rao, CT Chong, D Ho, DM Zhi, CS Choong, LPS Sharon, D Ismael, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1522-1529, 2016
992016
TSV interposer fabrication for 3D IC packaging
VS Rao, HS Wee, LWS Vincent, LH Yu, L Ebin, R Nagarajan, CT Chong, ...
2009 11th Electronics Packaging Technology Conference, 431-437, 2009
812009
Investigation on the effect of copper leadframe oxidation on package delamination
CT Chong, A Leslie, LT Beng, C Lee
1995 Proceedings. 45th Electronic Components and Technology Conference, 463-469, 1995
671995
Packaged semiconductor device having stress absorbing film
LT Beng, CT Chong, M Amagai, I Anjoh, J Arita, K Tsubosaki, M Ichitani, ...
US Patent 5,466,888, 1995
631995
Effect of TSV interposer on the thermal performance of FCBGA package
YYG Hoe, TG Yue, P Damaruganath, CT Chong, JH Lau, Z Xiaowu, ...
2009 11th Electronics Packaging Technology Conference, 778-786, 2009
502009
Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure
DQ Yu, TC Chai, ML Thew, YY Ong, VS Rao, LC Wai, JH Lau
2009 59th Electronic Components and Technology Conference, 930-935, 2009
342009
Design and fabrication of a reliability test chip for 3D-TSV
AD Trigg, LH Yu, X Zhang, CT Chong, CC Kuo, N Khan, Y Daquan
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
292010
Process and reliability of large fan-out wafer level package based package-on-package
VS Rao, CT Chong, D Ho, DM Zhi, CS Choong, SL PS, D Ismael, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 615-622, 2017
232017
Assembly and reliability of micro-bumped chips with through-silicon vias (TSV) interposer
YY Ong, TC Chai, D Yu, ML Thew, E Myo, LC Wai, MC Jong, VS Rao, ...
2009 11th Electronics Packaging Technology Conference, 452-458, 2009
212009
Comprehensive study on the interactions of multiple die shift mechanisms during wafer level molding of multichip-embedded wafer level packages
HS Ling, B Lin, CS Choong, SD Velez, CT Chong, X Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014
202014
Packaged semiconductor device having stress absorbing film
LT Beng, CT Chong, M Amagai, I Anjoh, J Arita, K Tsubosaki, M Ichitani, ...
US Patent 5,406,028, 1995
191995
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
JW Nah, JO Suh, KN Tu, SW Yoon, CT Chong, V Kripesh, BR Su, C Chen
56th Electronic Components and Technology Conference 2006, 6 pp., 2006
142006
Reliability of wire bonding on low-k dielectric material in damascene copper integrated circuits PBGA assembly
M Sivakumar, V Kripesh, CS Choong, CT Chong, LA Lim
Microelectronics Reliability 42 (9-11), 1535-1540, 2002
142002
Evaluation of support wafer system for thin wafer handling
WHSEETOH Justin, TC Chai, VS Rao, SWHO David, DM Fernandez, ...
2010 12th Electronics Packaging Technology Conference, 580-584, 2010
122010
Effects of TSV (Through Silicon Via) Interposer/Chip on the Thermal Performances of 3D IC Packaging
JH Lau, GY Tang, GYY Hoe, XW Zhang, TC Chai, P Damaruganath, ...
International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009
112009
Through mold interconnects for fan-out wafer level package
SW Ho, LC Wai, SA Sek, DI Cereno, BL Lau, HY Hsiao, TC Chai, VS Rao
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 51-56, 2016
92016
Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package
CT Chong, LT Guan, H Yong, FX Che, DHS Wee, SC Chong
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 19-24, 2020
82020
Double Mold Antenna in Package for 77 GHz Automotive Radar
SW Ho, SS Boon, LB Long, H Hsiang-Yao, CS Choong, SLP Siang, ...
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 257-261, 2020
72020
FOWLP RF Passive Circuit Designs for 77GHz MIMO radar applications
S Mei, LT Guan, XD Peng, CT Chong, S Bhattacharya
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 445-448, 2020
72020
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