| Development of 3-D silicon module with TSV for system in packaging N Khan, VS Rao, S Lim, HS We, V Lee, X Zhang, EB Liao, R Nagarajan, ... IEEE Transactions on Components and Packaging Technologies 33 (1), 3-9, 2010 | 204 | 2010 |
| Development of high density fan out wafer level package (HD FOWLP) with multi-layer fine pitch RDL for mobile applications VS Rao, CT Chong, D Ho, DM Zhi, CS Choong, LPS Sharon, D Ismael, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1522-1529, 2016 | 118 | 2016 |
| TSV interposer fabrication for 3D IC packaging VS Rao, HS Wee, LWS Vincent, LH Yu, L Ebin, R Nagarajan, CT Chong, ... 2009 11th Electronics Packaging Technology Conference, 431-437, 2009 | 86 | 2009 |
| Investigation on the effect of copper leadframe oxidation on package delamination CT Chong, A Leslie, LT Beng, C Lee 1995 Proceedings. 45th Electronic Components and Technology Conference, 463-469, 1995 | 73 | 1995 |
| Packaged semiconductor device having stress absorbing film LT Beng, CT Chong, M Amagai, I Anjoh, J Arita, K Tsubosaki, M Ichitani, ... US Patent 5,466,888, 1995 | 63 | 1995 |
| Effect of TSV interposer on the thermal performance of FCBGA package YYG Hoe, TG Yue, P Damaruganath, CT Chong, JH Lau, Z Xiaowu, ... 2009 11th Electronics Packaging Technology Conference, 778-786, 2009 | 58 | 2009 |
| Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure DQ Yu, TC Chai, ML Thew, YY Ong, VS Rao, LC Wai, JH Lau 2009 59th Electronic Components and Technology Conference, 930-935, 2009 | 35 | 2009 |
| Process and reliability of large fan-out wafer level package based package-on-package VS Rao, CT Chong, D Ho, DM Zhi, CS Choong, SL PS, D Ismael, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 615-622, 2017 | 31 | 2017 |
| Design and fabrication of a reliability test chip for 3D-TSV AD Trigg, LH Yu, X Zhang, CT Chong, CC Kuo, N Khan, Y Daquan 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 31 | 2010 |
| Assembly and reliability of micro-bumped chips with through-silicon vias (TSV) interposer YY Ong, TC Chai, D Yu, ML Thew, E Myo, LC Wai, MC Jong, VS Rao, ... 2009 11th Electronics Packaging Technology Conference, 452-458, 2009 | 22 | 2009 |
| Comprehensive study on the interactions of multiple die shift mechanisms during wafer level molding of multichip-embedded wafer level packages HS Ling, B Lin, CS Choong, SD Velez, CT Chong, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014 | 20 | 2014 |
| Packaged semiconductor device having stress absorbing film LT Beng, CT Chong, M Amagai, I Anjoh, J Arita, K Tsubosaki, M Ichitani, ... US Patent 5,406,028, 1995 | 19 | 1995 |
| Reliability of wire bonding on low-k dielectric material in damascene copper integrated circuits PBGA assembly M Sivakumar, V Kripesh, CS Choong, CT Chong, LA Lim Microelectronics Reliability 42 (9-11), 1535-1540, 2002 | 14 | 2002 |
| Double mold antenna in package for 77 GHz automotive radar SW Ho, SS Boon, LB Long, H Hsiang-Yao, CS Choong, SLP Siang, ... 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 257-261, 2020 | 13 | 2020 |
| Electromigration in Pb-free solder bumps with Cu column as flip chip joints JW Nah, JO Suh, KN Tu, SW Yoon, CT Chong, V Kripesh, BR Su, C Chen 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 13 | 2006 |
| Evaluation of support wafer system for thin wafer handling WHSEETOH Justin, TC Chai, VS Rao, SWHO David, DM Fernandez, ... 2010 12th Electronics Packaging Technology Conference, 580-584, 2010 | 12 | 2010 |
| Effects of TSV (Through Silicon Via) Interposer/Chip on the Thermal Performances of 3D IC Packaging JH Lau, GY Tang, GYY Hoe, XW Zhang, TC Chai, P Damaruganath, ... International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009 | 12 | 2009 |
| FOWLP AiP optimization for automotive radar applications S Mei, LT Guan, CT Chong, S Bhattacharya, MY Gang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1156-1161, 2021 | 11 | 2021 |
| Heterogeneous integration with embedded fine interconnect CT Chong, LT Guan, D Ho, H Yong, CS Choong, SLP Siang, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2216-2221, 2021 | 11 | 2021 |
| Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package CT Chong, LT Guan, H Yong, FX Che, DHS Wee, SC Chong 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 19-24, 2020 | 11 | 2020 |
