| High-speed channel modeling with machine learning methods for signal integrity analysis T Lu, J Sun, K Wu, Z Yang IEEE Transactions on Electromagnetic Compatibility 60 (6), 1957-1964, 2018 | 115 | 2018 |
| Electrical-thermal co-simulation for analysis of high-power RF/microwave components T Lu, JM Jin IEEE Transactions on Electromagnetic Compatibility 59 (1), 93-102, 2016 | 62 | 2016 |
| Microwave purification of large-area horizontally aligned arrays of single-walled carbon nanotubes X Xie, SH Jin, MA Wahab, AE Islam, C Zhang, F Du, E Seabron, T Lu, ... Nature communications 5 (1), 5332, 2014 | 54 | 2014 |
| Transient electrical-thermal analysis of 3-D power distribution network with FETI-enabled parallel computing T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 48 | 2014 |
| Electrical-thermal co-simulation for DC IR-drop analysis of large-scale power delivery T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (2 …, 2013 | 47 | 2013 |
| Thermal-aware high-frequency characterization of large-scale through-silicon-via structures T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014 | 36 | 2014 |
| Large-scale discrete Fourier transform on TPUs T Lu, YF Chen, B Hechtman, T Wang, J Anderson IEEE Access, 2021 | 35 | 2021 |
| Coupled electrical–thermal–mechanical simulation for the reliability analysis of large-scale 3-D interconnects T Lu, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017 | 34 | 2017 |
| Multiphysics simulation of 3-D ICs with integrated microchannel cooling T Lu, F Zhang, JM Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 31 | 2016 |
| Instruction-following evaluation for large language models J Zhou, T Lu, S Mishra, S Brahma, S Basu, Y Luan, D Zhou, L Hou arXiv preprint arXiv:2311.07911, 2023 | 26 | 2023 |
| Transient simulation for high-speed channels with recurrent neural network T Nguyen, T Lu, J Sun, Q Le, K Wu, J Schut-Aine 27th Conference on Electrical Performance of Electronic Packaging and Systems, 2018 | 26 | 2018 |
| Accelerating MRI Reconstruction on TPUs T Lu, T Marin, Y Zhuo, YF Chen, C Ma 2020 IEEE High Performance and Extreme Computing Conference, 2020 | 25 | 2020 |
| Through-wall imaging: Application of subspace-based optimization method T Lu, K Agarwal, Y Zhong, X Chen Progress In Electromagnetics Research 102, 351-366, 2010 | 23 | 2010 |
| Nonuniform Fast Fourier Transform on TPUs T Lu, T Marin, Y Zhuo, YF Chen, C Ma 2021 IEEE International Symposium on Biomedical Imaging (ISBI 2021), 2021 | 18 | 2021 |
| Deep learning models for predicting wildfires from historical remote-sensing data F Huot, RL Hu, M Ihme, Q Wang, J Burge, T Lu, J Hickey, YF Chen, ... arXiv preprint arXiv:2010.07445, 2020 | 18 | 2020 |
| Fast transient simulation of high-speed channels using recurrent neural network T Nguyen, T Lu, K Wu, J Schutt-Aine arXiv preprint arXiv:1902.02627, 2019 | 14 | 2019 |
| Simulation and characterization of singing capacitors in consumer electronics T Lu, M Ding, K Wu 2019 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2019 | 9 | 2019 |
| High-speed channel modeling with deep neural network for signal integrity analysis T Lu, K Wu, Z Yang, J Sun 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging …, 2017 | 9 | 2017 |
| Machine learning methods in high-speed channel modeling T Lu, K Wu DesignCon 2019, Santa Clara, CA, 2019 | 7 | 2019 |
| Enable language models to implicitly learn self-improvement from data Z Wang, L Hou, T Lu, Y Wu, Y Li, H Yu, H Ji arXiv preprint arXiv:2310.00898, 2023 | 6 | 2023 |
Jian-Ming JinProfessor of Electrical and Computer Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
