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Soon Wee Ho
Soon Wee Ho
Institute of Microelectronics
Verified email at ime.a-star.edu.sg
Title
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Cited by
Year
High RF performance TSV silicon carrier for high frequency application
SW Ho, SW Yoon, Q Zhou, K Pasad, V Kripesh, JH Lau
2008 58th Electronic Components and Technology Conference, 1946-1952, 2008
1592008
3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections
N Khan, LH Yu, TS Pin, SW Ho, V Kripesh, D Pinjala, JH Lau, TK Chuan
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (2 …, 2013
822013
Study of 15µm pitch solder microbumps for 3D IC integration
A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, DQ Yu, MC Jong, V Kripesh, ...
2009 59th Electronic Components and Technology Conference, 6-10, 2009
812009
Fabrication of high aspect ratio TSV and assembly with fine-pitch low-cost solder microbump for Si interposer technology with high-density interconnects
A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, WS Lee, MC Jong, VN Sekhar, ...
IEEE transactions on components, packaging and manufacturing technology 1 (9 …, 2011
652011
Solutions strategies for die shift problem in wafer level compression molding
G Sharma, A Kumar, VS Rao, SW Ho, V Kripesh
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011
612011
Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
A Yu, JH Lau, SW Ho, A Kumar, HW Yin, JM Ching, V Kripesh, D Pinjala, ...
2009 59th Electronic Components and Technology Conference, 350-354, 2009
582009
Microfabrication and characterization of W-band planar helix slow-wave structure with straight-edge connections
C Chua, JM Tsai, S Aditya, M Tang, SW Ho, Z Shen, L Wang
IEEE transactions on electron devices 58 (11), 4098-4105, 2011
552011
Embedded wafer level packaging for 77-GHz automotive radar front-end with through silicon via and its 3-D integration
R Li, C Jin, SC Ong, TG Lim, KF Chang, SW Ho
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013
392013
Application of piezoresistive stress sensors in ultra thin device handling and characterization
X Zhang, A Kumar, QX Zhang, YY Ong, SW Ho, CH Khong, V Kripesh, ...
Sensors and Actuators A: Physical 156 (1), 2-7, 2009
392009
77-GHz automotive radar sensor system with antenna integrated package
KF Chang, R Li, C Jin, TG Lim, SW Ho, HY Hwang, B Zheng
IEEE Transactions on components, packaging and manufacturing technology 4 (2 …, 2013
332013
Development of fine pitch solder microbumps for 3D chip stacking
A Yu, A Kumar, SW Ho, HW Yin, JH Lau, KC Houe, SLP Siang, X Zhang, ...
2008 10th Electronics Packaging Technology Conference, 387-392, 2008
322008
Development of coaxial shield via in silicon carrier for high frequency application
SW Ho, VS Rao, OKN Khan, SU Yoon, V Kripesh
2006 8th Electronics Packaging Technology Conference, 825-830, 2006
302006
3D interconnection process development and integration with low stress TSV
TT Chua, SW Ho, HY Li, CH Khong, EB Liao, SP Chew, WS Lee, LS Lim, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
242010
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages
X Ong, SW Ho, YY Ong, LC Wai, K Vaidyanathan, YK Lim, D Yeo, ...
Microelectronics Reliability 49 (2), 150-162, 2009
222009
Die package and a method for manufacturing the die package
V Kripesh, NKO Kalandar, SR Vempati, A Kumar, SW Ho, YLS Lim, ...
US Patent App. 12/673,503, 2011
202011
Double side redistribution layer process on embedded wafer level package for package on package (PoP) applications
SW Ho, FM Daniel, LY Siow, WH SeeToh, WS Lee, SC Chong, ...
2010 12th Electronics Packaging Technology Conference, 383-387, 2010
192010
Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5 D interposer and 3D-IC
SW Ho, L Ding, SH Lim, SA Sek, M Yu, GQ Lo
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 435-439, 2013
152013
Wafer Level Package and a Method of Forming the Same
TG Lim, YY Lim, YM Khoo, NKO Kalandar, F Che, SC Chong, SWD Ho, ...
US Patent App. 13/407,295, 2013
152013
Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device
CH Khong, X Zhang, N Khan, SW Ho, YY Lim, LC Wai, S Lim, V Kripesh, ...
2010 12th Electronics Packaging Technology Conference, 195-200, 2010
152010
Evaluation of support wafer system for thin wafer handling
WHST Justin, TC Chai, VS Rao, SWH David, DM Fernandez, LY Siow, ...
2010 12th Electronics Packaging Technology Conference, 580-584, 2010
122010
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