Faxing Che
Faxing Che
Micron Semiconductor Asia, Singapore
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Drop impact reliability testing for lead-free and lead-based soldered IC packages
DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low
Microelectronics Reliability 46 (7), 1160-1171, 2006
The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
FX Che, WH Zhu, ESW Poh, XW Zhang, XR Zhang
Journal of Alloys and Compounds 507 (1), 215-224, 2010
Effect of copper TSV annealing on via protrusion for TSV wafer fabrication
A Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ...
Journal of electronic materials 41 (9), 2533-2542, 2012
Vibration reliability test and finite element analysis for flip chip solder joints
FX Che, JHL Pang
Microelectronics reliability 49 (7), 754-760, 2009
Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability
L Xu, JHL Pang, F Che
Journal of Electronic Materials 37 (6), 880-886, 2008
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints
FX Che, JHL Pang
Journal of Alloys and Compounds 541, 6-13, 2012
Thermal fatigue reliability analysis for PBGA with Sn-3.8 Ag-0.7 Cu solder joints
FX Che, JHL Pang
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004
Study on Cu protrusion of through-silicon via
FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013
High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications
DA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che
Journal of electronic materials 41 (9), 2631-2658, 2012
Fatigue reliability analysis of Sn–Ag–Cu solder joints subject to thermal cycling
FX Che, JHL Pang
IEEE Transactions on Device and Materials Reliability 13 (1), 36-49, 2012
Modeling and design solutions to overcome warpage challenge for fan-out wafer level packaging (FO-WLP) technology
FX Che, D Ho, MZ Ding, X Zhang
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015
Study on process induced wafer level warpage of fan-out wafer level packaging
FX Che, D Ho, MZ Ding, DR MinWoo
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1879-1885, 2016
Interaction of multiple inhomogeneous inclusions beneath a surface
K Zhou, LM Keer, QJ Wang, X Ai, K Sawamiphakdi, P Glaws, M Paire, ...
Computer methods in applied mechanics and engineering 217, 25-33, 2012
Modeling and simulation of printed circuit board drop test
YQ Wang, KH Low, FX Che, HLJ Pang, SP Yeo
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003
Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5 Cu solder alloy bearing Fe for electronics applications
DAA Shnawah, SBM Said, MFM Sabri, IA Badruddin, FX Che
Materials Science and Engineering: A 551, 160-168, 2012
Effect of Ag content and the minor alloying element Fe on the mechanical properties and microstructural stability of Sn-Ag-Cu solder alloy under high-temperature annealing
DA Shnawah, MFM Sabri, IA Badruddin, SBM Said, T Ariga, FX Che
Journal of electronic materials 42 (3), 470-484, 2013
Drop Impact Analysis of Sn-Ag-Cu Solder Joints Using Dynamic High-Strain Rate Plastic Strain as the Impact Driving Force
JHL Pang
Proc. of 56th Electronic Components and Technology Conference, 2006, 49-54, 2006
Microstructural stability of Sn–1Ag–0.5 Cu–xAl (x= 1, 1.5, and 2 wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties
MFM Sabri, DA Shnawah, IA Badruddin, SBM Said, FX Che, T Ariga
Materials Characterization 78, 129-143, 2013
Modeling constitutive model effect on reliability of lead-free solder joints
FX Che, HLJ Pang, WH Zhu, W Sun, AYS Sun
2006 7th International Conference on Electronic Packaging Technology, 1-6, 2006
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards
Y Wang, KH Low, HLJ Pang, KH Hoon, FX Che, YS Yong
Microelectronics Reliability 46 (2-4), 558-573, 2006
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