Thermal destruction testing: an indirect approach to a simple dynamic thermal model of smart power switches M Glavanovics, H Zitta Proceedings of the 27th European Solid-State Circuits Conference, 221-224, 2001 | 55 | 2001 |
Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions. T Detzel, M Glavanovics, K Weber Microelectron. Reliab. 44 (9-11), 1485-1490, 2004 | 54 | 2004 |
A reliable technology concept for active power cycling to extreme temperatures M Nelhiebel, R Illing, C Schreiber, S Wöhlert, S Lanzerstorfer, M Ladurner, ... Microelectronics Reliability 51 (9-11), 1927-1932, 2011 | 51 | 2011 |
Impact of thermal overload operation on wirebond and metallization reliability in smart power devices M Glavanovics, T Detzel, K Weber Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat …, 2004 | 42 | 2004 |
A new cycle test system emulating inductive switching waveforms M Glavanovics, H Kock, H Eder, V Kosel, T Smorodin 2007 European Conference on Power Electronics and Applications, 1-9, 2007 | 26 | 2007 |
Transient non-linear thermal FEM simulation of smart power switches and verification by measurements V Kosel, R Sleik, M Glavanovics 2007 13th International Workshop on Thermal Investigation of ICs and Systems …, 2007 | 24 | 2007 |
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures H Köck, V Košel, C Djelassi, M Glavanovics, D Pogany Microelectronics Reliability 49 (9-11), 1132-1136, 2009 | 19 | 2009 |
Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices S de Filippis, H Köck, M Nelhiebel, V Košel, S Decker, M Glavanovics, ... Microelectronics Reliability 52 (9-10), 2374-2379, 2012 | 17 | 2012 |
Thermal simulation and ultrafast IR temperature mapping of a Smart Power Switch for automotive applications M Riccio, A Irace, G Breglio, P Spirito, V Kosel, M Glavanovics, A Satka 2009 21st International Symposium on Power Semiconductor Devices & IC's, 200-203, 2009 | 17 | 2009 |
Temperature sensor for a MOS circuit configuration E Pihet, M Glavanovics, T Krotscheck, R Zelsacher US Patent 6,948,847, 2005 | 17 | 2005 |
Reliable smart power system ICs for automotive and industrial applications-the Infineon smart multichannel switch family M Glavanovics, H Estl, A Bachofner Proceedings of PCIM Europe, 1-6, 2001 | 16 | 2001 |
Flexible active cycle stress testing of smart power switches M Glavanovics, H Köck, V Košel, T Smorodin Microelectronics Reliability 47 (9-11), 1790-1794, 2007 | 15 | 2007 |
A Bayesian mixture Coffin-Manson approach to predict semiconductor lifetime O Bluder, J Pilz, M Glavanovics, K Plankensteiner Proceedings of Stochastic Modeling Techniques and Data Analysis, 45-52, 2012 | 14 | 2012 |
Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms T Smorodin, M Stecher, M Glavanovics, J Wilde ESSDERC 2007-37th European Solid State Device Research Conference, 139-142, 2007 | 14 | 2007 |
Non-linear thermal modeling of DMOS transistor and validation using electrical measurements and FEM simulations V Košel, R Illing, M Glavanovics, A Šatka Microelectronics journal 41 (12), 889-896, 2010 | 12 | 2010 |
Modular Test System Architecture for Device, Circuit, and System Level Reliability Testing and Condition Monitoring R Sleik, M Glavanovics, S Einspieler, A Muetze, K Krischan IEEE Transactions on Industry Applications 53 (6), 5698-5708, 2017 | 10* | 2017 |
Cycle stress test equipment for automated short circuit testing of smart power switches according to the AEC Q100-012 standard M Glavanovics, HP Kreuter, R Sleik, C Schreiber 2009 13th European Conference on Power Electronics and Applications, 1-7, 2009 | 10 | 2009 |
Monitoring of parameter stability of SiC MOSFETs in real application tests M Sievers, B Findenig, M Glavanovics, T Aichinger, B Deutschmann Microelectronics Reliability 114, 113731, 2020 | 9 | 2020 |
Improved thermal management of low voltage power devices with optimized bond wire positions H Köck, C Djelassi, S de Filippis, R Illing, M Nelhiebel, M Ladurner, ... Microelectronics Reliability 51 (9-11), 1913-1918, 2011 | 9 | 2011 |
System level modeling of smart power switches using SystemC-AMS for digital protection concept verification HP Kreuter, V Kosel, M Glavanovics, R Illing 2009 IEEE Behavioral Modeling and Simulation Workshop, 37-42, 2009 | 8 | 2009 |