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Hongbin Shi
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Thermal cycling reliability of lead-free package stackable very thin fine pitch ball grid array assemblies with reworkable edge and corner bond adhesives
H Shi, T Ueda
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 …, 2011
31*2011
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
H Shi, F Che, T Ueda
Microelectronics Reliability 51 (9-11), 1850-1855, 2011
232011
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test
H Shi, T Ueda
Microelectronics Reliability 51 (9-11), 1898-1902, 2011
192011
Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods
H Shi, FX Che, C Tian, R Zhang, JT Park, T Ueda
Microelectronics Reliability 52 (9-10), 1870-1875, 2012
142012
Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies
H Shi, T Ueda
Proceedings of the 3rd International Conference on Computer Research and …, 2011
132011
A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring
S Hongbin, I Satoshi, U Toshitsugu
2011 IEEE Sensors, 1697-1700, 2011
8*2011
Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills
HB Shi, T Ueda
2011 IEEE 13th Electronics Packaging Technology Conference, 542-547, 2011
72011
Integrated circuit package component with ball conducting joints
HB Shi, JC Wu
US Patent App. 12/805,326, 2011
72011
Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives
H Shi, T Ueda
2011 3rd International Conference on Computer Research and Development 3 …, 2011
72011
Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model
R Zhang, H Shi, Y Dai, JT Park, T Ueda
Microelectronics Reliability 52 (9-10), 2331-2335, 2012
62012
Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading
H Shi, D Yu, T Ueda
2012 IEEE 62nd Electronic Components and Technology Conference, 965-976, 2012
62012
Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability
H Shi, T Ueda
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 …, 2011
62011
Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder
R Zhang, H Shi, T Ueda, J Zhang, Y Dai
2012 International Conference on Quality, Reliability, Risk, Maintenance …, 2012
52012
Methods of fabricating a semiconductor package
H Shi, M Hojeong, KJ Lee
US Patent 9,786,644, 2017
42017
Thermomechanical fatigue performance of lead-free chip scale package assemblies with fast cure and reworkable capillary flow underfills
H Shi, C Tian, T Ueda
Japanese Journal of Applied Physics 51 (5S), 05EE04, 2012
42012
Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly
HB Shi, T Ueda
2011 IEEE 13th Electronics Packaging Technology Conference, 579-584, 2011
42011
Board-Level Shear, Bend, Drop and Thermal Cycling Reliability of Lead-Free Chip Scale Packages with Partial Underfill: A Low-Cost Alternative to Full Underfill
H Shi, C Tian, M Pecht, T Ueda
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 774 - 785, 2012
32012
A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement strategies
H Shi, C Tian, D Yu, T Ueda
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 …, 2012
32012
Board-level solder joint reliability of edge-and corner-bonded lead-free chip scale package assemblies subjected to thermal cycling
H Shi, C Tian, T Ueda
Japanese Journal of Applied Physics 51 (4S), 04DB08, 2012
32012
Method for manufacturing semiconductor package
H Shi, S Kim, JH Lee
US Patent 9,953,964, 2018
22018
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Articles 1–20