| Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects T Jiang, C Wu, L Spinella, J Im, N Tamura, M Kunz, HY Son, B Gyu Kim, ... Applied Physics Letters 103 (21), 2013 | 76 | 2013 |
| Glass/glass photovoltaic module reliability and degradation: a review A Sinha, DB Sulas-Kern, M Owen-Bellini, L Spinella, S Uličná, SA Pelaez, ... Journal of Physics D: Applied Physics 54 (41), 413002, 2021 | 47 | 2021 |
| Electrochemical degradation modes in bifacial silicon photovoltaic modules DB Sulas‐Kern, M Owen‐Bellini, P Ndione, L Spinella, A Sinha, S Uličná, ... Progress in Photovoltaics: Research and Applications 30 (8), 948-958, 2022 | 18 | 2022 |
| Effects of wiring density and pillar structure on chip package interaction for advanced Cu low-k chips W Chu, L Spinella, DR Shirley, PS Ho 2020 IEEE International Reliability Physics Symposium (IRPS), 1-4, 2020 | 18 | 2020 |
| Chemical and mechanical interfacial degradation in bifacial glass/glass and glass/transparent backsheet photovoltaic modules L Spinella, S Uličná, A Sinha, DB Sulas‐Kern, M Owen‐Bellini, ... Progress in Photovoltaics: Research and Applications 30 (12), 1423-1432, 2022 | 14 | 2022 |
| Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects L Spinella, M Park, J Im, P Ho, N Tamura, T Jiang 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 14 | 2016 |
| Thermomechanical fatigue resistance of low temperature solder for multiwire interconnects in photovoltaic modules L Spinella, N Bosco Solar Energy Materials and Solar Cells 225, 111054, 2021 | 13 | 2021 |
| FTIR investigation of EVA chemical bonding environment and its impact on debond energy L Spinella, N Bosco IEEE Journal of Photovoltaics 9 (3), 790-795, 2019 | 12 | 2019 |
| UV-fluorescence imaging of silicon PV modules after outdoor aging and accelerated stress testing DB Sulas-Kern, S Johnston, M Owen-Bellini, K Terwilliger, J Meydbray, ... 2020 47th IEEE Photovoltaic Specialists Conference (PVSC), 1444-1448, 2020 | 11 | 2020 |
| Synchrotron X-ray microdiffraction investigation of scaling effects on reliability for through-silicon vias for 3-D integration L Spinella, T Jiang, N Tamura, JH Im, PS Ho IEEE Transactions on Device and Materials Reliability 19 (3), 568-571, 2019 | 11 | 2019 |
| The effective control of Cu through-silicon via extrusion for three-dimensional integrated circuits by a metallic cap layer G Jalilvand, O Ahmed, L Spinella, L Zhou, T Jiang Scripta Materialia 164, 101-104, 2019 | 9 | 2019 |
| Processing effect on via extrusion for TSVs in three-dimensional interconnects: A comparative study T Jiang, L Spinella, JH Im, R Huang, PS Ho IEEE Transactions on Device and Materials Reliability 16 (4), 465-469, 2016 | 7 | 2016 |
| Microstructure evolution and effect on resistivity for cu nanointerconnects and beyond ST Hu, L Cao, L Spinella, PS Ho 2018 IEEE International Electron Devices Meeting (IEDM), 5.4. 1-5.4. 3, 2018 | 5 | 2018 |
| Reliability Assessment of Fan-Out Packages Using High Resolution Moir¿¿ Interferometry and Synchrotron X-Ray Microdiffraction L Spinella, JH Im, PS Ho 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016 | 4 | 2016 |
| The scaling and microstructure effects on the thermal stress and reliability of through-silicon vias in 3d integrated circuits LE Spinella | 3 | 2017 |
| Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Plasticity and the Correlation to TSV Extrusion L Spinella, JH Im, N Tamura, T Jiang, PS Ho 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 752-757, 2017 | 2 | 2017 |
| Reliability implications of solder in multiwire modules under dynamic mechanical loading L Spinella, K Terwilliger, P Walker, G Perrin, CS Jiang, N Bosco 2021 IEEE 48th Photovoltaic Specialists Conference (PVSC), 0108-0111, 2021 | 1 | 2021 |
| Ribbons affect movement of cracked solar cells M Springer, L Spinella, TJ Silverman, N Bosco, J Joe, M Young, I Repins National Renewable Energy Laboratory (NREL), Golden, CO (United States), 2023 | | 2023 |
| Glass-glass PV modules: Characterization of chemical and mechanical degradation L Spinella, S Ulicna, A Sinha, DB Sulas-Kern, M Owen-Bellini, S Johnston, ... 2022 IEEE 49th Photovoltaics Specialists Conference (PVSC), 0649-0649, 2022 | | 2022 |
| Application of Electronics Packaging Fundamentals to Photovoltaic Interconnects and Packaging L Spinella, N Bosco International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | | 2019 |
Paul HoProfessor, University of Texas at AustinVerified email at austin.utexas.edu
