W.N. Putra
W.N. Putra
Verified email at
Cited by
Cited by
Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
A Heryanto, WN Putra, A Trigg, S Gao, WS Kwon, FX Che, XF Ang, J Wei, ...
Journal of Electronic Materials 41 (9), 2533-2542, 2012
Study on Cu Protrusion of Through-Silicon Via
FX Che, WN Putra, A Heryanto, A Trigg, X Zhang, CL Gan
Components, Packaging and Manufacturing Technology, IEEE Transactions on 3 …, 2013
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)
FX Che, WN Putra, A Heryanto, A Trigg, S Gao, CL Gan
3D Systems Integration Conference (3DIC), 2011 IEEE International, 1-6, 2012
Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics
FL Lau, RI Made, WN Putra, JZ Lim, VC Nachiappan, JL Aw, CL Gan
Microelectronics Reliability 53 (9), 1581-1586, 2013
3D EBAD characterizations on copper TSV for 3D interconnections
WN Putra, AD Trigg, HY Li, CL Gan
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st …, 2014
Microstructure investigation of TSV copper film
WN Putra, HY Li, AD Trigg, CL Gan
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 1414 …, 2013
Study of electrical property of Au-Ge eutectic solder alloys for high temperature electronics
LF Long, I Riko, WN Putra, EPJ Rong, LJ Zhang, LJ Dy, WC Cheong, ...
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th, 30-33, 2012
The system can't perform the operation now. Try again later.
Articles 1–7