| On the thermal buckling analysis of functionally graded plates with internal defects using extended isogeometric analysis T Yu, TQ Bui, S Yin, DH Doan, CT Wu, T Van Do, S Tanaka Composite Structures 136, 684-695, 2016 | 127 | 2016 |
| On the high temperature mechanical behaviors analysis of heated functionally graded plates using FEM and a new third-order shear deformation plate theory TQ Bui, T Van Do, LHT Ton, DH Doan, S Tanaka, DT Pham, ... Composites Part B: Engineering 92, 218-241, 2016 | 124 | 2016 |
| Analysis of bi-directional functionally graded plates by FEM and a new third-order shear deformation plate theory T Van Do, DK Nguyen, ND Duc, DH Doan, TQ Bui Thin-Walled Structures 119, 687-699, 2017 | 65 | 2017 |
| Hybrid phase field simulation of dynamic crack propagation in functionally graded glass-filled epoxy DH Doan, TQ Bui, ND Duc, K Fushinobu Composites Part B: Engineering 99, 266-276, 2016 | 64 | 2016 |
| Optimization of near-infrared laser drilling of silicon carbide under water N Iwatani, HD Doan, K Fushinobu International Journal of Heat and Mass Transfer 71, 515-520, 2014 | 52 | 2014 |
| Numerical modeling of 3-D inclusions and voids by a novel adaptive XFEM Z Wang, T Yu, TQ Bui, NA Trinh, NTH Luong, ND Duc, DH Doan Advances in Engineering Software 102, 105-122, 2016 | 51 | 2016 |
| A study of near-infrared nanosecond laser ablation of silicon carbide DH Duc, I Naoki, F Kazuyoshi International Journal of Heat and Mass Transfer 65, 713-718, 2013 | 33 | 2013 |
| A rate-dependent hybrid phase field model for dynamic crack propagation DH Doan, TQ Bui, T Van Do, ND Duc Journal of Applied Physics 122 (11), 115102, 2017 | 32 | 2017 |
| Enhanced nodal gradient 3D consecutive-interpolation tetrahedral element (CTH4) for heat transfer analysis MN Nguyen, TQ Bui, TT Truong, NA Trinh, IV Singh, T Yu, DH Doan International Journal of Heat and Mass Transfer 103, 14-27, 2016 | 32 | 2016 |
| Phase-field thermal buckling analysis for cracked functionally graded composite plates considering neutral surface T Van Do, DH Doan, ND Duc, TQ Bui Composite Structures 182, 542-548, 2017 | 26 | 2017 |
| Validation simulation for free vibration and buckling of cracked Mindlin plates using phase-field method DH Doan, T Van Do, PM Pham, ND Duc Mechanics of Advanced Materials and Structures 26 (12), 1018-1027, 2019 | 20 | 2019 |
| Fluidic laser beam shaper by using thermal lens effect HD Doan, Y Akamine, K Fushinobu International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 18 | 2011 |
| The stability of cracked rectangular plate with variable thickness using phase field method PP Minh, T Van Do, DH Duc, ND Duc Thin-Walled Structures 129, 157-165, 2018 | 15 | 2018 |
| Laser processing by using fluidic laser beam shaper HD Doan, I Naoki, F Kazuyoshi International Journal of Heat and Mass Transfer 64, 263-268, 2013 | 15 | 2013 |
| Phase-field buckling analysis of cracked stiffened functionally graded plates NV Hoai, DH Doan, NM Khoa, T Van Do, HT Tran Composite Structures 217, 50-59, 2019 | 12 | 2019 |
| High frequency modes meshfree analysis of Reissner–Mindlin plates TQ Bui, DH Doan, T Van Do, S Hirose, ND Duc Journal of Science: Advanced Materials and Devices 1 (3), 400-412, 2016 | 12 | 2016 |
| Nanosecond pulse laser scribing using Bessel beam for single shot removal of transparent conductive oxide thin film B Kim, R Iida, DH Doan, K Fushinobu International Journal of Heat and Mass Transfer 107, 829-835, 2017 | 11 | 2017 |
| Fluidic lens by using thermal lens effect HD Doan, Y Akamine, K Fushinobu International journal of heat and mass transfer 55 (23-24), 7104-7108, 2012 | 10 | 2012 |
| Mechanism of TCO thin film removal process using near-infrared ns pulse laser: Plasma shielding effect on irradiation direction B Kim, R Iida, HD Doan, K Fushinobu International Journal of Heat and Mass Transfer 102, 77-85, 2016 | 9 | 2016 |
| Mechanism of nanosecond laser drilling process of 4H-SiC for through substrate vias B Kim, R Iida, DH Doan, K Fushinobu Applied Physics A 123 (6), 392, 2017 | 8 | 2017 |
Tinh Quoc BuiAssociate Professor, Tokyo Institute of TechnologyVerified email at m.titech.ac.jp
